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Job Area:
Engineering Services Group, Engineering Services Group > Technical Support Engineering
This position involves in competitive power analysis in laptop/mobile device. This includes taking any commercial device and instrumenting (tear-down) that to enable perf and power measurements on that device while the original functional/thermal properties remain intact. This position will also require analytical skills to make sure the data coming out of competitive device instrumentation is accurate. This competitive power analysis will play a key role in making Qualcomm next generation GPU planning. This position also requires an excellent understanding of power delivery network on PCB. Tear down of windows OS based devices would be plus.
Minimum Qualifications
Detailed and thorough understanding of schematics and power delivery network system (be able to propose alternate options and make change). Experienced with hardware tear down (laptop, discrete cards, etc.) preserving the functional, thermal and performance integrity of the device.
Expert in using the regular Lab tools: DMM, SCOPE, DAQ, etc.
Advanced reworking and soldering skills (not only the blue wire reworking). Reverse engineering on component removal/replacement and keep the power delivery and electrical spec integrity intact.
Comfortable with Microsoft Excel for data processing and power point for presentation
Min 5 years on job experience
Preferred Qualifications
IPC certification level 3
Cell phone tear down experience
Bachelor’s degree preferred
10yr+ experience would be preferred
Experience of running applications on Windows OS
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
Pay range:
$104,000.00 - $156,000.00
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