Marvell Senior Staff Verification Engineer 

United States, Massachusetts 

600816530

What You Can Expect

• Develop photonics IC (PIC) and electronics IC (EIC) co-design flow.

• Define PIC and EIC IO pad frame and 2.5D interposer floor plan.

• Lead PIC and EIC interconnect schematic and layout design process.

• Define PIC and EIC hybrid integration packaging design rules, process flow, and material sets.

• Lead optical package development to establish package manufacturability and reliability.

• Collaborate with cross-functional teams consisting of Digital and Analog Circuit designers, Signal/Power Integrity, and substrate layout, and system design team.

• Drive optical product package qualification activities from initial concept to production.

What We're Looking For

• Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5+ years of related professional experience. Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3+ years of experience,

• Expertise in designing hybrid multi-chip integration using 2.5D/3D packaging. Direct experience in Si Photonics based packaging design is a plus.Experience in layout desig tools for ICs and or packaging, and 2.5D/3D EM simulation tools such as HFSS, SI-Wave, Momentum, IE3D, CST, PowerSI.

• Device or package characterization and testing as required in the developmentenvironment. Highspeed testing background is preferred.

• A strong understanding of wafer level packaging process flow.

• Direct experience in collaborating with major OSAT for developing advanced packaging technology for high-speed optics and/or electronics IC is a plus.

• Ability to work with a large body of data and the necessary statistical analysis tools, and the ability to present the data and ideas to a diverse audience.

• Effective communication and presentation

• Team player. Expected to work with cross-functional team.