2025暑期实习-封装工程师实习生/Packaging Engineering Intern
Chengdu, Sichuan, China
职位描述
- 负责研发新的封装要求和增强现有封装技术的竞争力；
- 制定封装技术指标以满足产品性能和客户要求；
- 与全球的产品、制造、供应商团队合作，执行封装表征、竞争力分析、研发实施、项目认证和量产引入；
- 与工厂紧密协作在制定和引入封装解决方案的同时保持产品质量；定义和更新集成电路或半导体组件部件的规格。
我们在寻找
- 理工科专业，2025.10~2026年毕业生；
- 优秀的英语听说读写能力；
- 独立思考能力；
- 团队合作精神；
- 良好的问题分析、解决能力，以结果为导向；
- 熟练操作Microsoft软件
Why TI?
- Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
- We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours.
- Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.
If you are interested in this position, please apply to this requisition.
TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.
Job Info
- 240003NS
- Job CategoryEngineering - Product Dev
- Posting Date18/02/2025, 10:20
- Degree LevelBachelor's Degree
- LocationsCDAT No.8-8 Kexin Road, High-tech Zone(West), Chengdu, 611731, CN
- ECL/GTC Required
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