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Honeywell Lead Semiconductor Manufacturing Engineer 
United States 
584814493

30.12.2024
JOB DESCRIPTION
Join the industry leader to design the next generation of breakthroughs

Lead Semiconductor Manufacturing Engineer You will report directly to our Sr Semiconductor Manufacturing Engineering Manager, and you'll work out of our Plymouth, MN location on an onsite work schedule.
KEY RESPONSIBILITIES

  • Develop and optimize new integrated fab and assembly processes into new product offering, and continuously improve aspects of the underlying technology integration
  • Collaborate with cross-functional teams and multiple organizations within Honeywell to drive innovation and continuous improvement
  • Ensure compliance with quality standards and regulatory requirements
  • Translate high level integration needs to specific process needs, and communicate those needs to the specific fab or assembly process experts so they can collaborate to find the best solutions
  • Troubleshoot and offer technical solutions to complex integration and manufacturing issues
  • Generate detailed technical reports, documentation, and presentations for internal and external stakeholders

U.S. CITIZEN REQUIREMENTS
Must be a US Citizen due to contractualrequirements.

The annual base salary range for this position is $128,000 - $160,000. Please note that this salary information serves as a general guideline. Honeywell considers various factors when extending an offer, including but not limited to the scope and responsibilities of the position, the candidate's work experience, education and training, key skills, as well as market and business considerations.

This position is incentive plan eligible.


• Bachelor’s degree from an accredited institution in a technical discipline such as science, technology, engineering, mathematics
• Minimum of 8 years of experience in advanced manufacturing
• Proficient knowledge of semiconductor manufacturing processes and equipment (including RIE, PVD, PECVD, LPCVD, wet etching, CMP, lithography, plating, die attach, flip chip assembly, column attach and mechanical interactions)
• Strong problem-solving and analytical skills
• USG Secret security clearance in good standing, or US Citizenship and no known barriers to achieve a USG Secret security clearance [non-citizens are ineligible for clearance]


WE VALUE
• Master's or higher degree in Electrical Engineering, Semiconductor Engineering, Chemical Engineering, Materials Science or related field
• Experience with advanced semiconductor manufacturing and assembly techniques
• Knowledge of industry standards and regulations
• Strong leadership, communication and team management skills

• Complex project management experience

• Microsoft Office suite capability

Additional Information
  • JOB ID: HRD246266
  • Category: Integrated Supply Chain
  • Location: 12001 State Highway 55,Plymouth,Minnesota,55441,United States
  • Exempt
  • Must be a US Citizen due to contractual requirements.