Nvidia Senior Signal Power Integrity Engineer - Hardware 

United States, Texas 

582599643

What you'll be doing:

• Work on crafting creative Signal Integrity solutions to complex system design problems.

• Modeling and Optimization of vias, connectors, sockets, breakouts and various system components in 3D EM tools.

• System-level signal integrity simulations of high-speed NVlink 200Gbs+, USB-4, PCIe5, GDDR6, LP5X and other interfaces.

• Constant improvements of SI models using data from lab measurements and/or modelling tool/methodology updates.

• Substrate and board layout SI guidelines creation, review and post layout SI extractions.

• Simulation automation, data gathering, analysis and visualization using JMP, MATLAB or similar tools.

• Opportunity to work in a dynamic cross-functional role to optimize package, PCB, ASIC, mixed signal circuit.

What we need to see:

• BS/MS-Electrical Engineering or equivalent experience

• 6+ years of industry experience.

• Strong technical background in applied electromagnatics, transmission line theory and signal processing will be highly valued.

• SI work on one or more signaling standards like PCI express, USB, SATA, HDMI, HBM, DDR5, GDDR6, LPDDR5X, etc.

• Hands on use of 3-D modeling tools like ANSYS HFSS/Q3D, 2.5-D with ANSYS SIWAVE or similar and 2D such as Ansys2D.

• Familiarity with a system level timing or loss budget including silicon, package and board impairments.

• Familiarity with use of VNA, TDR, DSO, ParBERT and use of tools/applications like ADS, Ansys Designer, JMP, Matlab, Cadence Allegro will be a plus.

Ways to stand out from the crowd:

• Expertise in one or more of the high speed interface SI/PI design on any industry standard system platforms.

• Experience with lab measurements, debugging, SI lab correlation using oscilloscope/ spectrum analyzer/ VNA.

• Knowledge of circuit design, board/pkg technology & design, link architecture, timing budget methodologies.

• Familiarity with PDN evaluation using layout extraction tools for packages and PCBs and spice-based time domain simulations.