ARM Staff Product Engineer 

United States, Texas, Austin 

572308070

Arm has an exciting opportunity for a Staff Product Engineer in our Product Engineering team. You will work with Architecture, SoC Design, Validation, Test, System, Software, and Quality teams throughout the company, to guide manufacturability of pioneering 3D SoIC-X and 2.5D CoWoS/EMIB system on package products with advanced 3D stacked HBM and own the manufacturing flow for optimal post-assembly yield. You will play a key role in preparing Arm and our partners on how to introduce new products in areas such as 2.5D/3DIC and sub-3nm nodes. The role drives industry leading products from pre-si readiness through post-si bring-up. The role requires hardworking product engineering focus on power, performance, cost and manufacturability.

• Work with line-of-business and architecture teams to understand product requirements.
• Own technical pre/post silicon operations cross product engineering aligning cross-functionally with design, packaging, software, silicon validation, test and quality.
• Be the point of contact for Product Engineering team for multi-functional collaborators.
• Work with partners on enhancing HBM yield and assembly yield using state of the art test methodology to detect HBM failures and assembly induced failures and drive yield improvement.
• Own post-silicon manufacturing test flow, yield improvement and package reliability qualification of advanced packages and advanced HBM memory in the package.
• Up to 20% travel within US and internationally for company and partner meetings.

• Bachelors, Masters, or Ph.D. degree in Electrical or Computer Engineering, with a strong CPU, SOC or GPU silicon bring-up and product engineering background.
• Minimum 12 years of experience in product engineering, including HBM and/or advanced package manufacturing test, yield improvement, characterization and reliability qualification.
• Broad expertise in structural/functional and high speed die to die interface test concepts (UCIE-A/S IO, HBM IO, DDR IO etc).
• Strong understanding of device physics, digital/mixed-signal design, foundry and assembly process and 3D, CoWoS-L/R/S, EMIB packaging technologies .
• Proficiency in IC data tools such as Silicon.da/Optimal+, JMP and data log parsing scripts.
• Excellent interpersonal skills, strong initiative and open in engaging and learning new concepts and sharing with collaborators!

• Experience in High speed IO Design and/or DFT.
• Experience in HBM design and/or DFT.
• Software scripting skills.