Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
6 years of experience in characterizing the performance, reliability, and yield of electronics or interconnect hardware.
6 years of process engineering or manufacturing experience in semiconductor and interconnect technologies such as photolithography, thin film deposition, electroplating and dry/wet etching and PCB or connector manufacturing.
6 years of experience in electrical connectors, Micro Electro Mechanical Systems (MEMS), semiconductors advanced packaging including design, development, and testing.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).