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Job Area:
Engineering Group, Engineering Group > Packaging Engineering
Examples of customer support areas:
Board level reliability (BLR) qualification.
SMT (Surface Mount Technology)
Packaging SMT/ BLR issue triage and root cause isolation
Product launch into HVM (High Volume Manufacture)
Design for manufacturability (DFM) reviews
Technology roadmap alignment and spec compliance reviews
Failing samples reviews
Publication of application notes and process recommendations
Examples of lab operations support areas:
FA (Failure Analysis) plan definition
FA reports
Lab daily operations supervisory
Supports to technicians
Examples of advanced package technologies supported
BGA (Ball Grid Array) and CSP (Chip Scale Package)
WLP (Wafer Level Package)
FO-WLP (Fan Out Wafer Level Package)
PoP (Package on Package)
LGA (Land Grid Array)
Other duties as needed
Collaboration with internal teams (quality, design, NPI, modeling, etc) to give regular profess updates
Project/ case management; statistical analysis including DOE methods
Interface with external suppliers and equipment vendors to understand latest technologies
Industrial benchmarking and competitive analysis
Minimum qualifications
Required to be fluent in Mandarin with functional proficiency in English
Permitted to work in mainland China with ability for oversea travel
Minimum of five years of experience in SMT/ BLR and package technology development
Must have strong written and oral communication
Working knowledge of
Package assembly process
Surface mount technology
Package reliability testing and failure modes
Underfill & rework
High temperature warpage analysis
Industry packaging trends and customer considerations
Package material analysis
Mechanical failure analysis techniques
Failure analysis tools & data analysis (Microscope/ Shadow Morrie/ X-ray/ CSAM/ EDX/ IR…)
IPC JEDEC and other industry specifications
Preferred qualifications
Independent decision maker and problem solver with little oversight needed
Previous experience with portable consumer products/ auto products and direct manufacturing experience with package assembly or SMT strongly preferred
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
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