Broadcom Hardware Engineer - Process SIP Assembly 

United States, California, San Jose 

56081792

Description:

You will be working primarily in the prototype assembly lab to participate in all SIP module build operations, develop, improve and troubleshoot SIP assembly processes, support machine PM execution, arrange facility works, and update daily build status.

Responsibilities:

• Become a process owner of many specific SIP assembly processes, primary wirebond and Datacon die attach.
• Backup the operation activities of other SIP assembly processes and oversee entire SIP assembly process flow
• Work in the prototype lab to participate in all SIP module build including hands-on machine programing and operations. After hours and weekend support are required occasionally
• Work with each process owners to develop, improve, and troubleshoot SIP assembly processes
• Initiate new equipment and process evaluation and buyoff plan
• Collaborate with R&D, QRE/NPI/FA teams on yield and quality issues. Investigate the root causes, trigger corrective actions and improvement plan and verify the effectiveness in the lab
• Initiate, lead and manage continuous process / yield improvement projects with process owners
• Work with each process owners to arrange and execute machine PM and keep spare parts of each machine to prevent machine downtime
• Arrange facility work, communicate with facility manager and team to resolve CDA, DI water, power issues to keep the lab in good operation condition
• Manage the floor plan, facility requirement, moving logistic for the new machine installation
• Join the weekly build plan meeting. Update daily build status. Response to all build status inquiries
• Perform design review and conduct Design for Manufacturability (DFM) and design rule optimization
• Work with packaging engineers on packaging and product development
• Create package drawings, specifications, reports, and production documentation using Cadence and AutoCAD

Requirements:

• Bachelor’s degree in Mechanical / Materials / Chemical and related engineering field
• 0 to 2 years of experiences in SIP assembly processes (SMT, die attach, wirebonding, molding, grinding, solder ball attach, laser marking, singulation, shielding...etc.)
• Hands on experiences wirebond, Datacon die attach, and other SIP assembly processes including machine programing and operations
• Solid technical understanding of full range of semiconductor packaging materials, material interactions, processes, critical parameters, dominant failure mechanisms and analytical techniques
• Understanding of statistics, control methodology, DOE, troubleshooting and problem solving techniques
• Good knowledge of packaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI)
• Good project leading, communication and presentation skills
• A great team member
• Experience on AutoCAD is a plus
• After hours and weekend support are required occasionally
• Willingness to travel for training and machine buy-off

Compensation and Benefits

The annual base salary range for this position is $66,000 - $105,000.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.