Nvidia Packaging Technical Lead - Hardware 

United States, Texas 

557958260

What you’ll be doing:

• Your responsibilities include defining the chip pad ring, substrate interconnect scheme, and lead the package layout design process.

• We collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers.

• We work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package!

• Communicate effectively with various teams throughout the company

What we need to see:

• BSEE or equivalent experience.

• At least 8+ years of relevant experience is required.

• Prior experience in board / system design or package design is preferred.

• Good understanding of transmission line theory, power delivery and signal integrity is desired!

• Strong programming and scripting skills in Perl, Python, Tcl desired, Cadence Skill and EXCEL familiarity are helpful.

• You are enthusiastic and able to work with a minimum of supervision.

• You seek to solve complex technical problems.