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a Better Future.
Applied Materials’ Packaging Plating and Cleans(PPC) Department is searching for an intern to join our team during summer 2025! Efforts will be focused on our state of the art electroplating tool depositing several metals during the creation of semiconductor devices. The position will entail the following:
Assist with laboratory plating demonstrations, to include: tool preparation, processing wafers, measuring wafers, documentation. Some chemical handling required.
Lead small development projects involving wafer metrology and chemical testing
Conduct electrochemical testing/analysis to investigate impact on plating results
Support process engineering testing
Analyze data and present findings to the group
Requirements
Student must be pursuing a Bachelor’s degree program in Materials Science & Engineering, Chemical Engineering, Chemistry, Physics, or a related field
Student must be in good academic standing at their university, with a preferred GPA of 3.0 or above on a 4.0 scale
Experience in semiconductor processing or manufacturing preferred
Quick learner
$29-31 per hour
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