High-Level Responsibilities:- Conceptualize and develop mechanical enclosures for electronic products.
- Lead, design, and deliver fixed or modular chassis and cards that meet system product requirements.
- Familiar with design requirements such as, structure, cooling, EMC, safety, manufacturability, cost, appearance, tolerances, documentation, conforming to a family of existing products, along with aggressive schedules.
- Solid understanding of all mechanical material properties, plating, painting process, thermal material, EMI gasket, heatsink design.
- Perform detailed 2D tolerance analysis for complex electro-mechanical assemblies using spreadsheet and/or 3D tolerance analysis tool such as CETol. Results to be presented in professional format
- Implement the selected design using Creo/NX 3D CAD and provide all the necessary drawings, critical to function dimensions, and 3D files to allow the design to be prototyped and manufactured.
- Design heat sinks using guidance from thermal simulations and create the drawings and 3D files to prototype and manufacture the parts.
- Define printed circuit board (PCB) sizes, outlines, and keep outs. Exchange IDF with ECAD engineer.
- Knowledge and experience in high speed I/O connector, board to board connector, cable connection design, power connector, and bus bar designs
- Collaborate with manufacturing team on DFM/DFA/production issues
- Drives resolution of issues with CAD and manufacturing engineers in developing innovative designs.
- Schedule and manage peer and cross-functional team reviews of your design.
- Provide technical design guidance and mentoring for junior engineers
- Teamwork: the candidate must be able to communicate well with cross-functional team members, be able to efficiently collaborate with team members to achieve project goals and contribute positively to the engineering community.
- Work with US team (HW & Mech) different time zone
- Must meet minimum proficiency level in English in speaking and writing
Who You'll Work WithYou will be working very closely with the rest of the Mechanical/Thermal group, cross-functionally with HW Engineering, Product Management/Marketing, Product Ops team, Global Supplier Management (GSM), External Vendors/Suppliers, Mfg Ops, and EMS/JDM partners.
Minimum Qualifications:
- BS in Mechanical Engineering or equivalent with 10+ years of EMS design experience.
- 8+ years of relevant experience in the mechanical design of computer/network equipment.
- Broad knowledge in design constraints associated with sheet metal, plastic, PCB layout, and die-cast design.
- Expert in tolerance analysis, Geometric Dimensioning and Tolerancing (GD&T) and statistical analysis
- Strong experience in sheet metal design for medium to high volume production
- Expert in use of 3D MCAD tools (Creo/NX)
- Excellent verbal skills and professional presentations.
- Must meet English proficient level CET 6 or equivalent in both verbal/written
Preferred Qualifications:- Strong knowledge in manufacturing tooling for sheet metal, plastic, and die-casting
- Strong experience in designing plastic and die-cast parts
- Strong mechanical aptitude
- Mechanism design experience a plus
- Experience in performing static and dynamic analysis using tools such as Creo Simulate or ANSYS
- A strong technical leader with proven track records in leading and successfully delivering projects
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