Applied Materials Process Integration Engineer 

United States, New York, City of Albany 

527042724

What We Offer

$128,000.00 - $176,000.00

We are seeking a highly skilled and experienced Process Integration Engineer to join our Photonics Platform Business Group with a focus on the area of optical interconnect and co-packaged optics. This position is in Applied Materials META Center at Albany, NY. As a Process Integration Engineer, you will be responsible of developing and optimizing process flows of optical and photonics devices as owner. You are expected to be highly detail-oriented and sharp minded in risk identification and mitigation. You will also be the first respondent of the device test and characterizations to drive flow iterations to improve the performance, yield, and reliability. You will work closely with cross-functional teams, including design, process, and equipment engineers, to drive continuous improvement and ensure seamless integration of processes throughout the development and manufacturing lifecycle.

Key Responsibilities:

· Own, manage, and drive technical programs/ project, report out timely status and interface with variousleading to completion.

· Interface with partner foundries to define, start, and drive JDPs to completion at high pace.

· Develop, optimize, and own process flows, ensuring the highest level of product performance, yield, and reliability.

· Collaborate with design, process, and equipment engineers to define and implement process integration strategies and methodologies.

· Manage integration lots across multiple sites.

· Collect on-wafer data, perform analysis, and provide outcome, learnings and plan for fast learning cycles.

· Stay updated with the latest advancements, industry trends, and competitor status and apply knowledge to drive innovations.

Basic Qualifications:

· Master or PhD degree in Electrical Engineering, Materials Science, Physics or a related field; Ph.D. preferred.

· 7-10 years of work experience in semiconductor processing. Proven experience in process integration, preferably R&D within a high-volume manufacturing foundry environment.

· Deep knowledge of semiconductor module processes used in FEOL transistors and BEOL interconnect, including lithography, etch, deposition, electroplating, CMP, wet clean, inline and failure analysis metrology.

· Proficient in statistical data analysis and process optimization and control techniques (e.g., Design of Experiments, SPC, JMP).

· Strong communication and interpersonal skills, with the ability to collaborate effectively with cross-functional teams.

· Detail-oriented and organized, with the ability to manage multiple projects and priorities simultaneously.

Preferred Qualifications:

· Direct experience of managing or working with foundry PDKs, from VLSI layout design, DRC, LVS, to photomask tape-out procedure is a plus.

· Direct experience of BEOL Cu interconnect e-test and reliability test is a plus.

· Knowledge of wafer-level packaging (e.g. through silicon via, hybrid bonding, wafer bonding and thinning) is a plus.

· Knowledge of Si photonics is a plus.

· Direct experience of SiView MES system is a plus.

Functional Knowledge

· Demonstrates in-depth and/or breadth of expertise in own discipline and broad knowledge of other disciplines within the function

· Anticipates business and regulatory issues; recommends product, process or service improvements

· May lead functional teams or projects with moderate resource requirements, risk, and/or complexity. Guide and train junior engineers.

Problem Solving

· Solves unique and complex problems with broad impact on the business; requires conceptual and innovative thinking to develop solutions

· Impacts the direction and resource allocation for program, project or services; works within general functional policies and industry guidelines

Interpersonal Skills

· Communicates complex ideas, anticipates potential objections and persuades others, often at senior levels, to adopt a different point of view

Full time

Assignee / Regular