ARM Principal Packaging Architect 

United States, California, San Jose 

521256398

You will play a key role in identifying key packaging technologies, establishing 3rd party relationships, communicating with partners and addressing challenges in areas such as 2.5D/3DIC and sub-3nm nodes. The role requires passionate engineering focus in areas such as package design, assembly yield analysis, die-to-die interfaces and manufacturing technologies.

• Pathfinding activities with new programs that optimize the system-level solution space
• Identifying innovative technologies that maximize the performance of Arm architectures
• Working closely with internal and external customer partners on silicon-disaggregation and other chiplet strategies for advanced packages, including emerging-memory chiplet integration
• Identifying critical elements for Arm’s packaging roadmap and disseminate these use strategies to key partners
• Driving design strategies for performance and manufacturability in packaging
• Working closely with external partners for driving successful assembly prototypes

• A strong understanding of package failure mechanisms and causes
• Expertise in package standards, 2.xD, 3D and other chiplet packaging methodologies
• Knowledge of signal integrity, power integrity thermal and thermos-mechanical principles
• Depth of knowledge in memory interfaces such as HBM3, GDDRR6, etc.
• Minimum 12 years of experience in package engineering, including advanced multichip system-in-package work.

• Excellent interpersonal skills, strong initiative and open in engaging and learning new concepts and sharing with collaborators.
• Bachelors, Masters, or Ph.D. degree or equivalent experience in Electrical Engineering or Mechanical Engineering