Qualcomm FEA Engineer 

United States, Oregon, Hillsboro 

509207270

Job Area:

Engineering Group, Engineering Group > Systems Engineering

Position: FEA Engineer

As an experienced(individual contributor), you will play a pivotal role within the platform team developing high-performance servers, collaborating with cross-functional teams, including packaging, electrical, thermal, mechanical, and component suppliers. You will be responsible for structural modeling, testing, and characterization of advanced server processors and high-performance computing systems from die to system level.

Key Responsibilities

• Perform advanced numerical modeling to analyze and optimize the reliability and manufacturability of server packages and system designs.

• Support the mechanical design of packages and systems from initial concept through detailed design and manufacturing readiness.

• Collaborate with internal teams to provide technical guidance, ensuring alignment with mechanical, reliability, and cost requirements.

• Conduct measurements and experiments to validate models, continuously enhancing their accuracy and robustness.

• Develop and maintain documentation, guidelines, and tools to support the design process and project success.

• Prepare and present technical documentation and reports to stakeholders, including engineering teams, senior management, customers, and suppliers.

Minimum Qualifications

• Master’s degree in Mechanical Engineering, Engineering Mechanics, Material Science, Physics, or a related field.

• 6+ years of hands-on experience in FEA modeling within the high-tech industry.

• Proficiency in major FEA tools (e.g., ANSYS, ABAQUS, Hypermesh, or equivalent).

• Experience in FEA modeling for microelectronics packaging, interconnects, sockets, BGAs, and board/system level.

• Ability to interpret complex numerical simulation results through fundamental engineering principles.

• Understanding of semiconductor processing, packaging techniques, materials, and server design considerations.

• Familiarity with reliability modeling for sockets, BGAs, and microelectronics packaging.

• Experience in designing and executing validation tests to verify analytical models and calibrate results with empirical data.

• Proven ability to work independently and collaboratively within a cross-functional team environment.

• Strong technical documentation skills and excellent written and verbal communication.

Preferred Qualifications

• Ph.D. in Mechanical Engineering, Engineering Mechanics, Material Science, Physics, or a related field.

• 10+ years of hands-on experience in FEA modeling within the high-tech industry.

• Expertise in structural FEA tools (e.g., ANSYS, ABAQUS, Hypermesh, or similar).

• Extensive experience in holistic structural analysis of die/package/BGA/socket/system structures.

• Solid understanding of advanced packaging and interconnect reliability modeling at the board/system level, with knowledge of microelectronics reliability testing and methodologies.

• Understanding of OCP product designs and industry best practices.

Minimum Qualifications:

• Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 8+ years of Systems Engineering or related work experience.

Master's degree in Engineering, Information Systems, Computer Science, or related field and 7+ years of Systems Engineering or related work experience.

PhD in Engineering, Information Systems, Computer Science, or related field and 6+ years of Systems Engineering or related work experience.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

$192,600.00 - $330,400.00