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Nvidia Senior Packaging Technical Engineer - Hardware United States, California 506545371
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What you’ll be doing:
Your responsibilities include defining the chip pad ring, substrate interconnect scheme, and lead the package layout design process.
We collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers.
Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package!
Communicate effectively with various teams throughout the company
What we need to see:
BSEE or equivalent experience.
Minimum of 8+ years in board/system design. Experience with package design is preferred.
Good understanding of transmission line theory, power delivery and signal integrity is desired.
Strong programming and scripting skills in Perl, Python, Tcl desired, Cadence Skill and EXCEL familiarity are helpful.
Enthusiastic and able to work with a minimum of supervision.
You seek to solve complex technical problems.
You will also be eligible for equity and .
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