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Google Interposer Physical Design Engineer United States, California, Sunnyvale 487160364
01.12.2024
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Minimum qualifications:
Preferred qualifications:
- Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
- 10 years of experience in ASIC physical design flows and methodologies in advanced process nodes.
- Experience with routing through custom routing or PnR tool routing.
- Experience with layout, physical verification, Design for Manufacturability (DFM), power and signal integrity analysis using industry standard tools.
- Experience with Controlled-Collapse Chip Connection (C4) bumps, micro bumps, Deep Trench Capacitor (DTC), Through-silicon via (TSV) etc.
Preferred qualifications:
- Experience with leading one or more aspects of interposer or package design.
- Experience in extraction of design parameters, Quality of Results (QoR) metrics, and analyzing trends.
- Knowledge of techniques for testing and debugging interposer designs, including electrical and thermal.
- Knowledge of semiconductor device physics and transistor characteristics.
- Understanding of thermal considerations for 3D stacked dies and interposers.
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