Western Digital Technician Engineering 

United States, Wisconsin 

482024600

Today’s exceptional challenges require your unique skills. It’s You & Western Digital. Together, we’re the next BIG thing in data.

This Job will focus on Western Digital Shanghai package RnD lab test and characterization, including but not limit to following items in semiconductor field.

1) Package, chip and PCB warpage test

2) Die and package mechanical strength test

3) DMA (Dynamic mechanical analysis) and TMA (Thermal mechanical analysis) test

4）Nanoindentation test and other lab test

The candidate should have bachelor's degree in mechanical material Engineering or similar background and have basic knowledge in mechanical and material test. additional requirement including:

1) Do thing in an attentive and dedicated manner

2) Be committed and down-to-earth

3) Be studious and positive