BS/MS or equivalent experience in Electrical Engineering, Material Engineering, or allied technical subject
5+ Years’ experience in image sensor engineering fields (Process Eng, Process integration engineering, or Product engineering)
In-depth understanding of wafer test, yield, wafer fab process integration, wafer packaging, back-end issues
Familiarity with wafer fab quality systems and in line process quality control. Ability to audit and approve vendor process, process flow and equipment for new devices
Working proficiency of the English and Japanese language
Preferred Qualifications
10+ years proven experience in image sensor devices/systems
Solid understanding of image sensor technology, performance metrics, sensor usage, test, and integration into module and camera system is preferred
Experience with external vendor, supplier, or foundry management
Interpersonal skills of leadership, project management, communication, collaboration, influencing and negotiation
Strong technical skills, involving problem solving and issue root causing in a pressured environment
Flexibility for within Japan travel (30%) + International Travel (< 5%). Evening and weekends work will be needed