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Apple Technical Program Manager TPM Image Sensor 
Japan, Tokyo 
472212632

19.12.2024
Minimum Qualifications
  • BS/MS or equivalent experience in Electrical Engineering, Material Engineering, or allied technical subject
  • 5+ Years’ experience in image sensor engineering fields (Process Eng, Process integration engineering, or Product engineering)
  • In-depth understanding of wafer test, yield, wafer fab process integration, wafer packaging, back-end issues
  • Familiarity with wafer fab quality systems and in line process quality control. Ability to audit and approve vendor process, process flow and equipment for new devices
  • Working proficiency of the English and Japanese language
Preferred Qualifications
  • 10+ years proven experience in image sensor devices/systems
  • Solid understanding of image sensor technology, performance metrics, sensor usage, test, and integration into module and camera system is preferred
  • Experience with external vendor, supplier, or foundry management
  • Interpersonal skills of leadership, project management, communication, collaboration, influencing and negotiation
  • Strong technical skills, involving problem solving and issue root causing in a pressured environment
  • Flexibility for within Japan travel (30%) + International Travel (< 5%). Evening and weekends work will be needed