Intel Die Attach TD Module Engineer 

Malaysia, Kedah 

43974797

The position is for Package Module Development Engineer for die attach module in Assembly and Test Technology Development (ATTD) as part of ATTD in Asia initiative. The candidate will define and establish process flow, procedures, and equipment configuration for NPI products. Selects and develops material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Plans and conducts experiments to fully characterize the process throughout the development cycle. Drives improvements on quality, reliability, cost, yield, processMinimum Qualifications:Bachelor, Master, or PhD degree in a relevant science, engineering, and technology fields (Physics, Mechanical, Chemical, Electrical, Electronic and Materials Engineering related field).Preferred qualifications:Experience in process and equipment engineering in semiconductorInvolvement in process development in assembly and packagingHas experience in die attach moduleLed product direct startup/NPIKnowledge in statistical design of experiments to characterize process and problem-solving techniquesCollege GradShift 1 (Malaysia)Malaysia, Kulim

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.