Broadcom R&D Process Engineer 

Singapore, Singapore 

429400357

• Responsible for designing/ implementing packaging process of new isolation products.
• Evaluates reliability of materials, properties and techniques, explore new process methodology used in production.
• Perform Design of Engineering Experiment (DOE) and optimization of new developed processes.
• Carry out R&D programs with IC designer, product engineer and manufacturing team, various support functions and contract Manufacturer to develop and perform process validation of new devices.
• Perform process yield analysis and failure investigation of new device issues.
• Plan and carry out engineering programs to achieve cost targets, breakthrough improvement in manufacturing yield, quality and reliability

Requirement:

• We are looking for an experienced R&D process engineer (Optocoupler).
• We need people with a strong ME background, semiconductor packaging process development skill. e.g. Die Attach, Wire bond, encapsulation Molding, package trim/forming, vision inspection tools
• Demonstrated and proven analytical/ critical thinking, problem solving and solution provider.
• Familiarized with mechanical lead-frame design rules/ tools, knowledge in semiconductor physical failure analysis.
• Experience in IC packaging, high voltage isolation requirements, material and processing techniques.
• Roles in NPI project leadership, taking product from verification/ qualification to high volume soft launch is advantageous.