Western Digital Senior Engineer Packaging Developing Engineering 

Philippines, Baguio 

426639577

But we can’t do it alone. Today’s exceptional data challenges require your exceptional skills. It’s You & Us. Together, we’re the next big thing in data.

• Die Preparation (DP) process evaluation for ASIC wafer, flip chip wafer and 3D NAND wafer assembly.
• New DP process recipe development to achieve high quality product and cost down.
• New DP technology evaluation and introduction.
• Co-work with material team with new package related material evaluation.
• Co-work with objective owner to handle new product DP process.

REQUIRED:

• Bachelor or above, major in Automation, Mechatronics, Materials Science and Technology, etc.
• 1-3 years’ process experience in Assembly.
• Good communication skill and team work spirit, willing to work under certain pressure.

PREFERRED:

• Strong Knowledge at assembly process.
• Good at AutoCAD, 3D drawing, Animations, Solidworks, JMP (Or other similar statistic software, Spot-fire) etc.
• Familiar with one of programming language will be a plus.

SKILLS:

• Good communication skill at both Chinese and English.