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Apple DRAM Packaging Engineer United States, California, San Diego 423369440
13.06.2024
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Key Qualifications
- 5+ years of experience working in package design and assembly process development for memory wirebond, stacked-die packages
- Proven understanding of assembly design rules, SIPI, and layout tradeoffs to enable high performance DDR or differential signaling
- Knowledgeable in packaging materials, substrate technology, and their mechanical and thermal behaviors
- Shown working experience in package test and reliability, system-level downstream process interaction and packaging inspection metrology
- Excellent engineering problem solving skills, with strong engineering physics and data driven analysis
- Strong written and verbal communication skills for working with internal multi-functional teams and OSATs
Education & Experience
- BS and 10+ years of relevant industry experience
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $161,700 and $284,900, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.
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