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Apple Sensing HW & Data Collection Systems Mechanical Engineer 
United States, California, Cupertino 
371537931

07.04.2025
In this role you will partner with multi-functional teams such as electrical, optical, embedded firmware, and software algorithm engineers to realize mechanical designs that integrate new technologies into systems for early-stage data collection. You will assist in setting technical requirements, defining specifications, design detailing, prototyping, fabrication, and owning the mechanical build process of low volume system manufacturingResponsibilities include:- Developing mechanical design of systems using 3D CAD, ensuring robustness and manufacturability. - Creating and evaluate proof-of-concepts, working with machine shops and vendors for fabrication- Plan and perform design validation, including thermal analysis and reliability testing.- Supporting assembly and integration processes, for internal engineering build or directing external contract manufacturers, and performing rapid failure analysis to to mitigate risks and maintain project timelines.- Collaborate multi-functionally to define and refine design, testing, and validation requirements, aligning with user specifications and operational needs.- Up to 20% domestic and international travel.
  • BS in mechanical engineering with at least 1+ year of relevant internship or industry experience in relevant field.
  • Proficiency in 3D CAD and creating 2D manufacturing drawings.
  • Strong mechanical engineering including analytical skills, material selection, and manufacturing processes based on engineering requirements.
  • Excellent written and verbal communication skills and people skills; ability to interact with management, team members and external vendors.
  • MS in mechanical engineering.
  • Fluent in Siemens NX and familiarity with flexible and rigid printed circuit boards design, fabrication and assembly.
  • Experience with thermal management, and optical, force, touch sensing technologies is a plus.
  • Hands-on experience integrating electronics, sensors and cameras to satisfy challenging packaging constraints.
  • Deep understanding of real-world manufacturing and quality control processes including IQC, IPQC, tolerance analysis, DFM/DFA, and GD&T.
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.