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Amazon Hardware Development Engineer Co-Op - Fall US 
United States, Washington, Seattle 
368521722

10.07.2024
DESCRIPTION

Applicants must be currently enrolled in a co-op program at their school in the US, and should have a minimum of one quarter/semester/trimester remaining in their studies after their co-op concludes.Start dates for our co-ops in this posting include the following periods:
• Fall (Starts August/September 2024)
Key job responsibilities
As a Hardware Development Engineer Co-Op intern you will engage with an experienced cross-disciplinary staff to conceive and design innovative consumer products. You will work closely with an internal inter-disciplinary team, and outside partners to drive key aspects of product definition, execution, and test. You must be responsive, flexible and able to succeed within an open collaborative peer environment.
• Perform schematic design.
• Validate hardware and debug issues.
• Develop automated test tools (labview, HPVEE).
• Travel to support engineering builds.
A day in the life
You will be part of a project team you will work alongside Senior Electrical Engineers; supporting the design, debug, validation and optimization of the products. You will be involved in projects from concept through production, gaining exposure to the complete design lifecycle. You will also support engineering builds gaining experience with high volume manufacturing.Seattle, WA, USA

BASIC QUALIFICATIONS

• Currently working towards a Bachelor’s, Master's, or PhD Degree in Electrical Engineering, Computer Engineering, Systems Engineering, or other equivalent discipline, with an expected conferral date between May 2025 – December 2028.
• Currently enrolled in a co-op program in the US.
• Embedded systems projects experience.
• Analog and digital skills with embedded systems experience.
• Knowledge of schematic design and debug skills.


PREFERRED QUALIFICATIONS

• Strong analytic and problem-solving skills.
• Additional domain expertise, such as PCB, Optical, Radio Frequency, Robotics, Thermodynamics, Acoustics, Antenna, etc.