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Apple Packaging Substrate Engineer United States, California 33302915
08.02.2025
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Minimum Qualifications
- BS and 20+ years of relevant industry experience.
- Proven fundamentals in the material/chemistry/ or mechanical engineering field(s).
- In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.
Preferred Qualifications
- MS or Ph.D. and 15+ years of relevant industry experience.
- Hands-on experience in substrate manufacturing and technology development: Cu plating, Lithography, Dielectric material, Laser via formation, Solder resist, etc.
- Familiar with package assembly and integration process preferred.
- Experience in Cadence Allegro platform tools and design review for manufacturing (DFM).
- Exceptional technology development & project management skills.
- Strong communication & collaborative skills.
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $207,800 and $378,700, and your base pay will depend on your skills, qualifications, experience, and location.Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.
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