Google Hardware Engineering Intern BS/MS Summer United States, California, Mountain View 33217078
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, 2025.
Timing on when you can hear back will vary and can take upwards of 90+ days. If you haven’t heard from us in three months about your application, we likely proceeded with other candidates for the role.
Participation in the internship program requires that you are located in the United States for the duration of the internship program.
This internship is intended for students in their penultimate academic year, who are pursuing a Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Computer Engineering, Computer Science, or a related technical field.
To start the application process, you will need an updated CV or resume and a current unofficial or official transcript in English. Click on the “Apply” button on this page and provide the required materials in the appropriate sections (PDFs preferred):- In the “Resume Section:” attach an updated CV or resume.
- In the “Education Section:” attach a current or recent unofficial or official transcript in English.
- Under “Degree Status,” select “Now attending” to upload a transcript.
Applicants in the County of Los Angeles: Qualified applications with arrest or conviction records will be considered for employment in accordance with the Los Angeles County Fair Chance Ordinance for Employers and the California Fair Chance Act.
Applicants in San Francisco: Qualified applications with arrest or conviction records will be considered for employment in accordance with the San Francisco Fair Chance Ordinance for Employers and the California Fair Chance Act.
This role may also be located in our Playa Vista, CA campus.
- Currently pursuing a Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Computer Engineering, Computer Science, or a related technical field.
Preferred qualifications:
- Currently attending a degree program in the US and available to work full time for 12 weeks outside of university term time.
- In their penultimate academic year or returning to a degree program after completion of the internship.
- Experience in one or more of the following areas: hardware system integration (board design, board bring-up), signal and power integrity, system validation, product design (mechanical/thermal), computer architecture, FPGAs, embedded systems, or memory systems (FEA or CFD), modeling or simulation for power/thermal analysis, or prototyping, testing, and debugging of data center systems in a lab environment.
- Experience with data center systems, consumer electronics or device manufacturing.
- Experience in one or more of the following areas: board layout (e.g., working with CAD/PCB design), CAD tools (e.g., NX, Creo, or Solidworks), Systems Integration.
- Familiarity with electromechanical assemblies, manufacturing techniques, fabrication techniques, or rapid prototyping or technical subsystems such as wireless, antenna, radio frequency, imaging, display, sensors, audio, charging power, or batteries.
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