Applied Materials Advanced Packaging Disruptive Technology Engineer 

United States, Texas, Austin 

323303742

$148,000.00 - $203,500.00

Key Responsibilities

• On-site Process Integration for novel wafer level assembly flows including but not limited to hybrid bonding, TSV and RDL technology.
• Works with business unit in technology development and transfer to customers including customized process development.
• Plans unit process sequence based on customer requirements.
• Negotiates process specifications and service offerings with customers.
• Takes ownership of delivering the required solution to the customers that meets specification.
• Serves as the customer expert across a broad range of products.
• Plays a key role in defining product strategy and identifying gaps.
• Provides feedback to business unit heads on process and hardware improvements to meet customer roadmap requirements.
• Takes the lead in positioning new technologies to customers utilizing technical information from division.
• Interfaces with customers at key development and manufacturing sites to form strategic partnerships to evaluate new and emerging technologies and oversees joint development activities or beta-site testing programs.
• Makes executive level presentations.
• Resolves significantly complex field process issues utilizing systematic troubleshooting methodology generally involving multiple processes.
• Create a mechanism to communicate issues, track progress and pull resources from multiple BU's and/or functions.
• Uses sound statistical techniques and problem solving methodologies like DOEs (Design of Experiment) to quickly determine root cause and action plans.
• Communicates learnings from this portion to rest-of-world to strengthen the product packages
• Provides oversight of customer demos, including defining demo conditions and analyzing results.
• Assists account teams in managing the customer account to enhance customer satisfaction and increase AMAT’s product and technical reputation.
• Keeps abreast of new developments in own and related technology groups. Participates in publishing in ET conferences and journals.

Functional Knowledge

• Regarded as the technical expert in Wafer Advanced Packaging Technology
• Demonstrates in-depth expertise in Wafer Advanced Packaging Technology and broad knowledge of Advanced Packaging 2d, 2.5D and 3D packaging architectures.

Business Expertise

• Anticipates business and regulatory issues; recommends product, process or service improvements

Leadership

• Leads projects with notable risk and complexity; develops the strategy for project execution

Problem Solving

• Solves unique and complex problems with broad impact on the business; requires conceptual and innovative thinking to develop solutions

Impact

• Impacts the direction and resource allocation for program, project or services; works within general functional policies and industry guidelines

Interpersonal Skills

• Communicates complex ideas, anticipates potential objections and persuades others, often at senior levels, to adopt a different point of view

Full time

Assignee / Regular