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What you'll be doing:
Analyzing semiconductor failures to assist Supplier FA teams and coordinate problem-solving efforts between engineering, SMT manufacturing, electronic component manufacturers, and characterization teams to determine physical root cause
Supporting corrective actions for component failures; including PCBA assembly, packaging, processing, and die-level design failures
Conducting non-destructive imaging such as 3D Xray, Ultrasound, Thermal imaging to identify physical defects on die, board and system level and aid physical target preparation
Using Physical Sample preparation such as mechanical cross-sectioning, parallel de-layering, chemical and plasma etch de-processing of IC devices at die, package, component, and board levels
Performing deep-dive Material Analysis using EDX, XRD, AFM and similar to identify the chemical composition
Summarize the Failure Analysis findings in a comprehensive report and discuss it with internal and external customers and suppliers
Develop Material Analysis improvement strategies that help increasing the overall product quality
What we need to see:
Possess an in-depth understanding of semiconductor IC, IC package and board fabrication/assembly processes with focus on Material Analysis
Proficiency in IC Package device fault isolation and sample preparations for various failure analysis tasks, including defect localization and physical root cause analysis
Hands-on experience in non-destructive testing, physical sample preparation, Optical & Electron microscopy and Material Analysis
Familiarity in mechanical cross sectioning, Focused Ion Beam system and laser based package preparation
Proficient with FTIR, EDX, XPS, XRD, Ion Chromatography and respective analysis methods
Strong written and verbal communication skills
10+ years of industrial experience in IC failure analysis
Master degree in Science or Engineering or equivalent experience
You will also be eligible for equity and .
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