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Acacia Communications designs intelligent transceivers using advanced signal processing and photonic integration for the 100G, 400G and 1T bit speed fiber optic transmission market deployed in data center, metro, long-haul and ultra-long haul telecommunication networks.
As a member of the Photonic Integrated Circuits (PIC) team, you will be a key member of a small, dynamic group that develops advanced photonics chips for optical communications products. You will assist in the design, simulation, layout and testing of photonic components and circuits on die, wafer and assembly levels.
You will design, and numerically model, passive and active photonic components with tools such as FDTD, HFSS and COMSOL. You will also perform script-based GDS layout of photonic components, circuits and full product chips.
You will work very closely with the entire PIC team covering a wide variety of directions, including silicon photonics and III-V device designs, simulation, foundry process development, production tapeouts, PIC testing, and production support. You will also work closely with millimeter wave design team, packaging team, and module hardware / software / optics testing team in building complete products.
Minimum requirements:We tackle whatever challenges come our way. We have each other’s backs, we recognize our accomplishments, and we grow together. We celebrate and support one another – from big and small things in life to big career moments. And giving back is in our DNA (we get 10 days off each year to do just that).
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