Bachelor’s degree or foreign equivalent in Electrical Engineering, Mechanical Engineering, Computer Engineering, Electrical and Computer Engineering, or related field and 1 year of experience in the job offered or related occupation.
1 year of experience in each of the following skills is required:
Applying system level engineering concepts including: digital signal processing; noise, interference, and electromagnetic modeling and bench top analysis.
Conducting board-level analog and mixed-signal design in all phases of schematic capture physical layout, development, validation and BoM Management, with Electronic Computer-Aided-Design (ECAD) tools, including Altium, Allegro, Cadence, KLayout
Analyzing PCB and semiconductor material stackup and manufacturing process, including dielectric constant and stackup layer thickness, for design recommendation and failure mode investigation
Performing circuit and FEA simulations with tools, including SPICE, COMSOL, Ansys HFSS and SiWave, to model and evaluate system performance
Developing software and scripting toolsets in Python, SQL, Matlab to automate and streamline data manipulation and analysis in volume production (e.g. data conditioning, data type structure conversions, and data filtering).
Applying machine learning and statistical analysis tools, including NumPy, SciPy, TensorFlow and scikit-learn, to scientific modeling, data analysis and failure analysis in volume production
Performing hardware and software design version control with Git and Subversion
Programming firmware in C/C++ and Python to control electronic systems with communication protocols, such as I2C, SPI, USB and JTAG
Conducting physical and electrical failure analysis from failure identification and root cause analysis, to corrective action implementing with Keyence, MicroVu, FIB-SEM, TDR/VNA, oscilloscopes and other lab tools
Collaborating with both domestic and international manufacturing partners on design for manufacturing, process improvements, and failure analysis