Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
10 years of experience in IC product development or test engineering, and manufacturing (i.e., characterization, qualification, bring-up, yield improvement, and debug).
6 years of experience in people management, developing employees.
Experience building test program and HVM floor engineering support/management.
Experience working with vendors.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience in wafer probe card, ATE hardware, and managing suppliers on execution of test hardware development and bring-up.
Experience in test engineering, DFT, test hardware, and test program development (e.g., Teradyne UltraFlex, Advantest 93k platforms).
Experience in programming/scripting (e.g., C and C++, Python, or Perl).
Knowledge of probability and statistical fundamentals for data analysis and process control design.