- Design, build, prototype testing the next generation broad band plasma (BBP) Wafer inspection opto-mechanical assemblies.
- Work with system, optical, electrical and software engineer to derive the subsystem requirements and conduct design reviews.
- Lead group of engineers for technical development, vendor management, schedule & product cost management.
- CAD Modeling: Cero experience preferred
- Track record of full life cycle high precision (sub-micron level) mechanism development experience. High accuracy alignment & adjustment design, design for repeatability & stability, tolerance analysis, design for reliability, design for vibration
- Thermal management design: electronics thermal management, cooling flow simulation & optimization.
- CAE: thermal & structural simulation (ANSYS experience preferred)
- Qualify and release the mechanism design, provide support for onsite manufacturing.
- Collaborate with manufacturing team during product ramp-up to support and trouble-shoot product issues.
- Full-time onsite is required.
Minimum Qualifications
Doctorate (Academic) Degree and related work experience of 5 years; Master's Level Degree and related work experience of 8 years; Bachelor's Level Degree and related work experience of 12 years
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