Cisco Microelectronics Numerical Analysis Engineer 

United States, Georgia, Atlanta 

216330625

The application window is expected to close on: 08/01/2025.

Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received.

Your Impact

You will help shape next-generation package, board, and system technologies by driving advanced simulation, experimental validation, and cross-functional optimization. Working closely with Silicon Design, Supply Chain, and Electrical Design teams, your contributions will directly influence reliability, performance, and manufacturability across programs—while also supporting long-term technology roadmaps and industry leadership. Specific responsibilities include:

• Develop and apply novel simulation and experimental methods to enable and optimize advanced hardware technologies. This includes scalable multiphysics models to predict system-level performance, reliability, and manufacturability (e.g., solder joint reliability, warpage, SMT defects, TIM behavior).
• Design and execute DOEs/test vehicles and computational analyses to establish design guidelines and optimize material, geometry, and architecture.
• Evaluate tradeoffs across performance, reliability, and manufacturability using modeling and analysis.
• Define failure limits and reliability testing requirements through both physical validation and accelerated testing models.
• Collaborate with academia and industry partners; contribute to standards bodies, conferences, IP development, and peer-reviewed publications.

Minimum Qualifications

• MS or PhD in Mechanical Engineering, Civil Engineering, Solid Mechanics, or Materials Science.
• 8+ years of experience in numerical analysis (e.g., FEA, CFD, coupled field analysis) and advanced packaging technology development.
• Strong background in mechanical design, reliability, and simulation of complex packaging structures, with a deep understanding of component- and board-level failure modes (e.g., warpage, CTE mismatch, delamination, fatigue).
• Proficiency in advanced simulation tools such as ANSYS Mechanical, Multiphysics, and Flotherm, with a track record of validating models through experimental methods.
• Demonstrated expertise in reliability testing, lifetime prediction methodologies, and characterization of real-world use conditions.

Preferred Qualifications

• Experience with 2.5D/3D advanced packaging, heterogeneous integration, and emerging microelectronics technologies.
• Knowledge of JEDEC or IPC standards related to reliability and thermal/mechanical testing.
• Track record of contributions to patents, publications, or industry standards in the field of packaging reliability or numerical analysis.
• Strong cross-functional collaboration skills with experience working closely with design, manufacturing, and research teams.