Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
5 years of industry experience in the SI/PI field.
Experience in industry SIPI modeling tool chains (e.g., HFSS, ADS, Sigrity, Siwave, etc).
Preferred qualifications:
Experience in collaborating with cross-functional teams, including chip top design, physical design, Static Timing Analysis (STA), package, and system teams.
Experience with 2.5D/3D package design (e.g., silicon interposer, silicon bridge, 3D die stacking, STA, Voltage budget).
Expertise in signal and power integrity for various high speed interconnects (e.g., HBMx, D2D, Ethernet, PCIe and etc).
Familiarity with post Si test environment on memory or high speed serdes.
Familiarity to next generation memory and chiplet standards and timing budget methodology.
Excellent programming and data analysis skill with Matlab, Python, C++ and etc to establish automation flows and data processing.