Amazon Sr ASIC Tech Biz Dev Manager - SPACE PROGRAM 

United States, Washington 

156296714

Key job responsibilities
In this role you will:
• Negotiate and secure customized design and manufacturing engineering services agreements with defined technical and business commits. Variety of contracts may include: terms sheets, NDAs, MOU/LOIs, SOWs, Design/Services. etc..
• Influence internal/external C-Suite executives and applying sound business judgement combined with technical acumen.
• Analyze Silicon Chip industry package and ATE trends and emerging technologies to identify differentiating solution acquisition, capability investment and cost/risk reduction opportunities that benefit Amazon and its’ customers
• Define and structure multi-party business models that solve IP ownership, capability and operational barriers.
• Drive ASIC package, ATE, Qualification/FA Engineering/Consulting Services supplier strategies and selection.
• Develop negotiation strategies; lead cross-functional negotiation teams; anticipate and mitigate contractual/operational risks.
• Evaluate opportunities to improve cost, reduce risk and win other favorable commercial/legal terms with vendors`.
• Assess and influence thermal-mechanical-electrical design trade-off optimization in package and ATE definition and selection based on vendor/technology capability vs yield, quality, and through-put stability and velocity risks.
• Develop processes and tracking mechanisms to manage project execution and progress reporting that ensure obligations are met in a timely and competent manner.
• Communicate proposals and recommendation/justification to gain executive approval of technology business deals.
• Prepare and deliver business reviews to senior leadership updating on progress and roadblocks.Export Control Requirement:Work/Life Balance
Mentorship & Career Growth

- Bachelor degree in engineering or business/related technical/quantitative field with relevant applied technical work history.
- 5+ years of experience with progressive responsibility in strategic technology sourcing and/or business development in some combination of – IC wafer fabrication, package substrate / lead-frame, ATE, IC Qualification/Characterization/FA on semiconductor products targeted for consumer electronics, client/enterprise compute, networking communication, IoT, Mobile Communications, Automotive, and aerospace avionics fields.
- 5+ years of Silicon Package design, productization, and/or manufacturing industry experience
- 3+ years of technology business development or semiconductor design-consulting, contract manufacturing, and testing services in either procurement or sales – including demonstrated record negotiating contracts for hardware and services deals w/ tier1 major technology companies across the IC ecosystem.