Nvidia Senior FA Engineer - Supplier Quality 

United States, California 

137099829

What you'll be doing:

• Performing electrical analysis and fault localization to assist Supplier FA teams in evaluations or experiments for physical root cause analysis, design optimization and process improvement for new product yield and reliability

• Conducting non-destructive imaging such as 3D Xray, Ultrasound, EOTPR, Thermal imaging to identify physical defects on die, board and system level and aid physical target preparation

• Using Physical Sample preparation such as mechanical cross-sectioning, parallel de-layering, chemical and plasma etch de-processing of IC devices at die, package, component, and board levels

• Summarize the Failure Analysis findings in a comprehensive report and discuss it with internal and external customers and suppliers

• Develop Failure Analysis improvement strategies that help increasing the overall product quality

What we need to see:

• Possess an in-depth understanding of semiconductor IC, IC package and board fabrication/assembly processes

• Proficiency in IC Package device fault isolation and sample preparations for various failure analysis tasks, including defect localization and physical root cause analysis

• Hands-on experience in non-destructive testing, physical sample preparation, Optical & Electron microscopy

• Proficient in mechanical cross sectioning, Focused Ion Beam system and laser based package preparation

• Familiarity with 2D/3D X-Ray, Ultrasound, Curve-tracing, Thermal/Photo Emission Microscopy, CAD layout, and respective analysis methods

• Strong written and verbal communication skills

• 8+ years of industrial experience in IC failure analysis

• B.S. degree in Science or Engineering or equivalent experience