Qualcomm Automotive Packaging Engineer NPI Tech Dev - Modules 

United States, California, San Diego 

114148790

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

Responsibilities:

• Responsible for exploring, defining business justification, development and HVM deployment of Automotive Module packaging technologies.

• Responsible for defining module process flow, material set, test vehicle, DOEs, process control plans to successfully develop manufacturable and reliable SIP/Module products.

• Interface with OSATs/CMs and component suppliers in developing technology related to SiP product requirements. Align with internal product teams.

• Work with internal design team and drive DFM methodology for new technologies. Maintain FMEA for module product development.

• Work with internal design, modeling and procurement teams to implement technically best and lowest cost SIP options.

• Technical program management to plan, execute, and monitor complex process or product developments. Regular updates on program status to management.

Minimum Qualifications:

• Bachelor's degree in Materials Science and/or Mechanical Engineering and/or Chemical Engineering

• 5+ years Hardware and/or Packaging/Module NPI experience or related work experience.

Preferred Qualifications:

• Experience with semiconductor packaging, SIP/Module packaging, manufacturing process experience with wafer processing, Flipchip, wirebond, Underfill, Molding, SMT and other semiconductor packaging technologies.

• Experience working with OSATs, suppliers, internal design and product teams.

• Experience with new product development in electronic packaging, exposure to design and characterization techniques, DFM methodology, design of experiments and statistical data analysis.

• Automotive experience with IC Packaging, Module Packaging, and/or ECU Hardware development

Education Qualifications:

Required: Bachelor's in Materials Science and/or Mechanical Engineering and/or Chemical Engineering

Preferred: Master's or PhD, Industrial Engineering, Materials Science and/or Mechanical Engineering and/or Chemical Engineering

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range:

$144,000.00 - $216,000.00