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Essential Responsibilities:
Expected Qualifications:
Additional Responsibilities & Preferred Qualifications
Responsibilities:
Qualifications:
Travel Percent:
The total compensation for this practice may include an annual performance bonus (or other incentive compensation, as applicable), equity, and medical, dental, vision, and other benefits. For more information, visit .
The US national annual pay range for this role is $81,000 to $133,100
Our Benefits:
Any general requests for consideration of your skills, please
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Job Description:
Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.
Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms.
The ideal candidate will have to drive strategic development activities and work closely with internal and external customer organizations to plan, execute and communicate development activities and programs.
The team leverages both experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids.
The team typically uses a combination of simulations and experiments, as needed, to help solve practical engineering problems.
The team frequently leverages advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches.
Note:This role requires regular onsite presence to fulfill essential job responsibilities. Provides tactical and strategic operational support to ensure the successful development and ramp of a high volume or technology development fabrication facility.
The ideal candidate should exhibit the following skills or behavioral traits:
Demonstrated ability to work seamlessly between experiments and simulations.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and orschoolwork/classes/research.
Minimum Qualifications:
Preferred Qualifications:
Experience with multi-physics simulations, including coupledelectro-thermal-mechanicalanalysis, free surface two phase flows, electroplating and plasma.
Experience with designing, planning and executing experiments, along with interpretation of results.
Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows.
Strong understanding of advanced packaging technologies, familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow.
Programming/script development with artificial intelligence and machine learning concepts.
Previous related work experience in asemiconductor foundry preferred
offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US: 100,160.00 USD - 193,390.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.These jobs might be a good fit

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As a Product Manager, you know what it takes to design, develop and drive the adoption of great digital products and services.
Your key responsibilities
Working with strategists, designers, developers and other key stakeholders, you will be responsible for concepting, designing, and developing digital products and services that address a market opportunity.
You will create personas, conduct product research to inform concepts and new features, design products, and develop the corresponding user stories and requirements. You will manage the product backlog, work day-to-day with the engineering teams to clarify requirements and recommend alternative approaches to meeting business requirements when necessary.
You will conduct ongoing experimentation and evaluate user feedback, usage of the product and key metrics, with an eye toward continuously improving the product and user experience.You also will drive ongoing market and user research to shape the longer-term product strategy and product roadmap.
Skills and attributes for success
To qualify for the role you must have
Ideally, you will have
What we look for
What we offer you
At EY, we’ll develop you with future-focused skills and equip you with world-class experiences. We’ll empower you in a flexible environment, and fuel you and your extraordinary talents in a diverse and inclusive culture of globally connected teams. Learn .
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TEAM OVERVIEW:
KEY RESPONSIBILITIES:
TECHNICAL SKILLS:
REQUIREMENTS/EDUCATION:
Applications will be reviewed on a rolling basis. Please apply by January 30, 2026. Note: This position may close early based on application volume or candidate selection.
Full timeNew College GradThese jobs might be a good fit

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We are seeking an experienced NPI Transfer Manager to lead new product introduction and technology transfer initiatives from concept through production qualification. This role serves as the primary interface between ourAdvanced Packaging Technology and Development
Key Responsibilities
1. NPI Leadership and Execution
2. Cross-Functional Collaboration
3. Customer Interface and Relationship Management
4. Technical Support and Problem Resolution
Required Experience
Preferred Experience
Key Competencies
Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US: 187,330.00 USD - 264,470.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.These jobs might be a good fit

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This job is responsible for engaging clients in the lobby to educate and assist with conducting transactions through self-service resources, such as mobile banking, online banking, or ATM. Key responsibilities include accurately and efficiently processing cash transactions for clients as needed. Job expectations include having deep conversations with clients to gain in-depth knowledge of the financial and life priorities and connecting clients to solutions that meet the financial goals.
Responsibilities:
Required Qualifications:
Desired Qualifications:
Skills:
High School Diploma / GED / Secondary School or equivalent
1st shift (United States of America)These jobs might be a good fit

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Develop and validate detailed finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, thermal cycling, and reliability risks across a wide range of package architectures.
Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on materials and properties to understand material behavior and reliability failure mechanisms.
Support technology roadmap development by evaluating new materials, interconnect structures, and process flows from a thermo-mechanical reliability perspective.
Drive design-of-experiment studies and sensitivity analyses to understand key drivers of package performance and reliability
Contribute to the development and automation of internal simulation workflows, tools, and best practices to improve modeling efficiency and accuracy
Develop solutions to problems utilizing formal education, experience and engineering judgment
Communicate recommendation and solution space to internal and external customers. Responds to customer/client requests or events as they occur.
Document and present simulation methodologies, results, and recommendations to both technical and executive audiences
Stay current with industry trends, emerging technologies, and academic research in advanced packaging and simulation methodologies
Strong communication skills across internal and external stakeholders andplanning/prioritizationskills for project success
Ability to handle ambiguity and use appropriate skills (behavioral and/or technical) to drive clarity across stakeholders
Willingness to lead and influence both external and internal teams
Willingness to work independently with minimal supervision
Technical problem-solving skills in a highly dynamic team environment
This role requires regular onsite presence to fulfill essential job responsibilities. Provides tactical and strategic operational support to ensure the successful development and ramp of a high volume or technology development fabrication facility.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.Minimum Qualifications:
Master's Degree in Mechanical Engineering, Chemical Engineering, Material Sciences or a related field and 7+ years of industry experience
-OR- PhD Degree in Mechanical Engineering, Chemical Engineering, Material Sciences or a related field and 4+ years of industry experience
Industry experience should include the following:
Thermo-mechanical FEA modeling in semiconductor packaging domain
At least one of the commercial FEA tools such as ANSYS, ABAQUS and COMSOL
Advanced packaging technologies such as Foveros, EmIB, Cowos and Hybrid bonding.
Semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow.
Preferred Qualifications:
Experience with multi-physics simulations, including coupledelectro-thermal-mechanicalanalysis, free surface two phase flows, electroplating and plasma
Familiarity with JEDEC reliability standards and qualification tests
Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows
Experience in technical program management in any assembly or test functional area
Experience in driving yield improvement activities for advanced package architectures
Previous related work experience in asemiconductor foundry preferred
Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US: 136,990.00 USD - 264,470.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.These jobs might be a good fit

Share
Essential Responsibilities:
Expected Qualifications:
Additional Responsibilities & Preferred Qualifications
Responsibilities:
Qualifications:
Travel Percent:
The total compensation for this practice may include an annual performance bonus (or other incentive compensation, as applicable), equity, and medical, dental, vision, and other benefits. For more information, visit .
The US national annual pay range for this role is $81,000 to $133,100
Our Benefits:
Any general requests for consideration of your skills, please
These jobs might be a good fit