Packaging jobs
Intel Mechanical Analysis Packaging Engineer United States, Texas
Share
Job Description:
Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.
Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms.
The ideal candidate will have to drive strategic development activities and work closely with internal and external customer organizations to plan, execute and communicate development activities and programs.
The team leverages both experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids.
The team typically uses a combination of simulations and experiments, as needed, to help solve practical engineering problems.
The team frequently leverages advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches.
Note:This role requires regular onsite presence to fulfill essential job responsibilities. Provides tactical and strategic operational support to ensure the successful development and ramp of a high volume or technology development fabrication facility.
The ideal candidate should exhibit the following skills or behavioral traits:
Demonstrated ability to work seamlessly between experiments and simulations.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and orschoolwork/classes/research.
Minimum Qualifications:
- Master's Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics and 3+ years of relevant experience
- -OR- PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related fieldwith emphasis in solid mechanics
Preferred Qualifications:
Experience with multi-physics simulations, including coupledelectro-thermal-mechanicalanalysis, free surface two phase flows, electroplating and plasma.
Experience with designing, planning and executing experiments, along with interpretation of results.
Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows.
Strong understanding of advanced packaging technologies, familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow.
Programming/script development with artificial intelligence and machine learning concepts.
Previous related work experience in asemiconductor foundry preferred
Position of Trust
offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US: 100,160.00 USD - 193,390.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.These jobs might be a good fit
Intel Advanced Packaging Technology Development NPI Transfer Manag... United States, New Mexico, Albuquerque
Share
We are seeking an experienced NPI Transfer Manager to lead new product introduction and technology transfer initiatives from concept through production qualification. This role serves as the primary interface between ourAdvanced Packaging Technology and Development
Key Responsibilities
1. NPI Leadership and Execution
- Lead comprehensive New Product Introduction (NPI) and technology introduction processes from early engagement planning through sample generation, Product Release Qualification (PRQ), and transfer certification
- Demonstrate strong leadership capabilities to drive teams forward during ambiguous situations, resolve competing priorities, and logically balance NPI loading across the network with high product and technology variation
- Formalize business processes to facilitate resource mobilization and close competency gaps, achieving both efficiency and effectiveness across operations and product/package platforms
2. Cross-Functional Collaboration
- Foster strategic collaboration with Division teams, Technology Development, and supply chain organizations that contribute to transfer success
- Partner with Technology Development (TD), Factory NPI teams, and all partners to drive solutions from NPI through End of Life (EOL)
- Collaborate with factory NPI team and TD key players to track and resolve all technical issues during NPI transfer
3. Customer Interface and Relationship Management
- Serve as the main interface to customers (e.g. CCG, DCG) and customer-facing teams (e.g. PBG), acting as the Voice of the Customer to APTM NPI operations
- Develop in-depth understanding of customer needs across various business units (CCG, DCG, NEX, PSG, FS) leveraging Foundry Services Expertise and OSAT benchmark knowledge
- Represent APTM NPI in customer Quarterly Business Reviews (QBRs) or Quarterly Technical Review (QTRs), site visits, audits, and aligned customer operational metrics reviews
- Lead NRE (Non-Recurring Engineering) and SOW (Statement of Work) engagements on behalf of APTM NPI
4. Technical Support and Problem Resolution
- Provide comprehensive technical support to resolve NPI and High Volume Manufacturing (HVM) issues
- Track and close all technical opens in collaboration with cross-functional teams
- Partner with TD to drive technology readiness and represent HVM-friendly voice in technology affordability initiatives
Required Experience
- Proven experience in NPI management and product transfer processes
- Strong background in semiconductor manufacturing, and backend operations e.g. assembly, and test operations
- Demonstrated ability to manage complex, multi-stakeholder projects
- Excellent communication and presentation skills for customer-facing responsibilities
- Experience with foundry operations and customer relationship management
Preferred Experience
- Experience with various customer segments
- Proven record in managing NPI department and Transfer Programs
Key Competencies
- Strategic thinking and problem-solving abilities
- Strong leadership and team management skills
- Customer relationship management
- Cross-functional collaboration
- Technical expertise in manufacturing processes
- Ability to work effectively in ambiguous and fast-paced environments
- Bachelor's degree in Engineering, Manufacturing, or related technical field
- 10 years of experience in NPI management and product transfer processes
Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US: 187,330.00 USD - 264,470.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.These jobs might be a good fit
Intel Senior Mechanical Analysis Packaging Engineer United States, Texas
Share
Develop and validate detailed finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, thermal cycling, and reliability risks across a wide range of package architectures.
Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on materials and properties to understand material behavior and reliability failure mechanisms.
Support technology roadmap development by evaluating new materials, interconnect structures, and process flows from a thermo-mechanical reliability perspective.
Drive design-of-experiment studies and sensitivity analyses to understand key drivers of package performance and reliability
Contribute to the development and automation of internal simulation workflows, tools, and best practices to improve modeling efficiency and accuracy
Develop solutions to problems utilizing formal education, experience and engineering judgment
Communicate recommendation and solution space to internal and external customers. Responds to customer/client requests or events as they occur.
Document and present simulation methodologies, results, and recommendations to both technical and executive audiences
Stay current with industry trends, emerging technologies, and academic research in advanced packaging and simulation methodologies
Strong communication skills across internal and external stakeholders andplanning/prioritizationskills for project success
Ability to handle ambiguity and use appropriate skills (behavioral and/or technical) to drive clarity across stakeholders
Willingness to lead and influence both external and internal teams
Willingness to work independently with minimal supervision
Technical problem-solving skills in a highly dynamic team environment
This role requires regular onsite presence to fulfill essential job responsibilities. Provides tactical and strategic operational support to ensure the successful development and ramp of a high volume or technology development fabrication facility.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.Minimum Qualifications:
Master's Degree in Mechanical Engineering, Chemical Engineering, Material Sciences or a related field and 7+ years of industry experience
-OR- PhD Degree in Mechanical Engineering, Chemical Engineering, Material Sciences or a related field and 4+ years of industry experience
Industry experience should include the following:
Thermo-mechanical FEA modeling in semiconductor packaging domain
At least one of the commercial FEA tools such as ANSYS, ABAQUS and COMSOL
Advanced packaging technologies such as Foveros, EmIB, Cowos and Hybrid bonding.
Semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow.
Preferred Qualifications:
Experience with multi-physics simulations, including coupledelectro-thermal-mechanicalanalysis, free surface two phase flows, electroplating and plasma
Familiarity with JEDEC reliability standards and qualification tests
Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows
Experience in technical program management in any assembly or test functional area
Experience in driving yield improvement activities for advanced package architectures
Previous related work experience in asemiconductor foundry preferred
Position of Trust
Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US: 136,990.00 USD - 264,470.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.These jobs might be a good fit
Applied Materials Product Management - Packaging United States, California
Share
Key Responsibilities
Develops abstract scope business & marketing plans, assesses market penetration and product positioning to drive competitive advantage, revenue and market share
Recommends investment decisions for new product development
Partners with Engineering, Manufacturing and Sales to develop new products and enhance existing products as well as communicate critical market needs and time requirements
Supports the Field to ensure synergistic account approaches and optimization of all opportunities for account partnership and penetration
Manages release of abstract products through the end of their product life cycle
Functional Knowledge
- Regarded as the technical expert in their particular field
Demonstrates in-depth and/or breadth of expertise in own discipline and broad knowledge of other disciplines within the function
Business Expertise
- Anticipates business and regulatory issues; recommends product, process or service improvements
Leadership
- Leads projects with notable risk and complexity; develops the strategy for project execution
Problem Solving
- Solves unique and complex problems with broad impact on the business; requires conceptual and innovative thinking to develop solutions
Impact
- Impacts the direction and resource allocation for program, project or services; works within general functional policies and industry guidelines
Interpersonal Skills
- Communicates complex ideas, anticipates potential objections and persuades others, often at senior levels, to adopt a different point of view
Required Qualifications
- Ph.D. in Electrical/Chemical Engineering, Materials Science, Physics, or related field.
- Minimum 5 years of experience in semiconductor industry, preferably in advanced packaging or heterogeneous integration.
- Strong technical understanding of wafer-level processes, interconnect technologies, and integration flows.
- Excellent communication and presentation skills for technical and executive audiences.
- Proven project management experience and ability to lead cross-functional initiatives.
- Strong business acumen with ability to link technical capabilities to market value.
Preferred Qualifications
- Experience in leading-edge semiconductor manufacturing or ecosystem companies (e.g., major IDMs, foundries, or equipment suppliers).
- Familiarity with hybrid bonding, TSV, RDL, and advanced packaging architectures.
- Ability to perform competitive benchmarking and articulate differentiation.
- Experience turning technology strategy into market-driven business plans.
These jobs might be a good fit
Intel Senior Packaging Thermal Architect United States, Texas
Share
Role Overview:
The Senior Thermal Architect will lead thermal design and strategy for next-generation GPU, AI accelerators, and data center products. This role is critical to enabling high-performance computing at scale while meeting stringent thermal requirements. You will define thermal architecture across silicon, package, and platform levels, ensuring optimal thermal performance for products approaching multi-kilowatt levels:
Key Responsibilities:
- Define and deliver advanced packaging thermal solutions for advanced GPU/AI products
- Architect thermal strategies for 3DIC and advanced packaging technologies, including chiplets and heterogeneous integration.
- Develop analytical and experimental methods for thermal characterization and prediction.
- Drive co-optimization of thermal, electrical, and mechanical design across silicon, package, and system levels.
- Push the boundaries of thermal management to support Moore's Law progression.
- Evaluate and integrate emerging cooling technologies (e.g., liquid cooling, immersion cooling) for data center sustainability.
- Partner with silicon design, packaging, and platform teams to ensure thermal compliance and performance.
- Engage with external customers and ecosystem partners to align thermal solutions with product requirements.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Knowledge and/or experience listed below would be obtained through a combination of your school, work and/or classes and/or research and/or relevant previous job and/or internship experiences
Minimum Qualifications
- MS or PhD in Mechanical Engineering, Thermal Sciences, or related field.
- 10+ years in thermal design of semiconductor products
- Proven track record in thermal architecture and advanced packaging.
- Proficient in thermal simulation tools (e.g., CFD, FEA) and experimental validation.
Preferred Qualifications
- 10 + years experience in high-performance computing or data center products.
- Proven track record in GPU/AI thermal architecture and advanced packaging.
- Experience with rack-scale cooling solutions and liquid cooling technologies.
- Familiarity with AI/GPU performance trends and their thermal implications.
- Strong understanding of power delivery, energy efficiency, and cooling technologies.
- Ability to influence architecture decisions and drive innovation across global teams.
Position of Trust
Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US: 136,990.00 USD - 262,680.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.These jobs might be a good fit
Boston Scientific Senior Packaging Engineer United States, Minnesota
Share
Your responsibilities include:
- Perform all aspects of the monthly financial close including generation of monthly and quarterly management reporting and variance/trend analysis
- Supports the annual planning process for the functional areas of responsibility including coordinating with the various functional groups to develop operating expense budgets and providing analytical support to identify key business drivers
- Analysis and submission of functional budgets
- Support decision-making process to enable profitable growth
- Support regular and adhoc reporting and presentations to management
- Identify and drive cost saving opportunities across the SG&A functions
- Quickly respond to numerous ad hoc queries from internal customers (including Senior Management)
Minimum Qualifications:
- Bachelor’s degree in Finance or Accounting
- 5+ years of relevant FP&A experience
- MS Excel and PowerPoint required, financial tools (Hyperion (Oracle), SAP) preferred
- Excellent oral and written communication skills
- Strong financial analysis, communication, organizational and prioritization skills
- Strong attention to detail and data accuracy
Preferred Qualifications:
- Ability to multi-task and set priorities/execute in a high-paced organization
- Ability to work in a dynamic environment, adhere to tight deadlines
- Team orientated
- Must have a process improvement mindset and strong problem-solving skills
Compensation fornon-exempt (hourly), non-sales rolesmay also include variable compensation from time to time (e.g., any overtime and shift differential) and annual bonus target (subject to plan eligibility and other requirements).
Compensation forexempt, non-sales rolesmay also include variable compensation, i.e., annual bonus target and long-term incentives (subject to plan eligibility and other requirements).
For MA positions:It is unlawful to require or administer a lie detector test for employment. Violators are subject to criminal penalties and civil liability.
Please be advised that certain US based positions, including without limitation field sales and service positions that call on hospitals and/or health care centers, require acceptable proof of COVID-19 vaccination status. Candidates will be notified during the interview and selection process if the role(s) for which they have applied require proof of vaccination as a condition of employment. Boston Scientific continues to evaluate its policies and protocols regarding the COVID-19 vaccine and will comply with all applicable state and federal law and healthcare credentialing requirements. As employees of the Company, you will be expected to meet the ongoing requirements for your roles, including any new requirements, should the Company’s policies or protocols change with regard to COVID-19 vaccination.
These jobs might be a good fit
Boston Scientific Packaging Engineer III United States, Minnesota
Share
Your responsibilities will include:
- Generate innovative and unique solutions to meet market needs; submit ideas and disclosures. Work is expected to result in the development of new or refined packages, products, processes or equipment.
- Successfully complete complex engineering work in technology development, packaging/product design and development, test of materials or products, preparation of specifications, process study, research investigation (animal and clinical studies), and/or report preparation.
- Coordinate, manage, and document project goals and progress; design and coordinate appropriate tests and experiments to solve complex problems; summarize, analyze, and assess test results; and make sound design recommendations.
- Generate and manage packaging related documentation, including specifications, test plans and reports, and other PDP documents.
- Assess the feasibility and soundness of alternative engineering processes, products, or equipment.
- Manage the completion of packaging testing for new product development and existing design improvements.
- Interface with Physicians/Cath Lab personnel to obtain feedback on concepts and performance of new devices or packages.
- Translate customer needs into product requirements and design specifications.
- Work cooperatively with various BSC departments, divisions, and suppliers, leading teams as assigned, to ensure an improved, practical, and consistent approach to packaging.
- Demonstrate PDP/TPD system knowledge through delivery of high quality and high impact deliverables.
- As applicable, train and/or supervise technicians and/or interns.
Required qualifications:
- Bachelor’s degree in Packaging Engineering, or equivalent related engineering discipline.
- Minimum of 3 years of Packaging R&D experience.
- ISO 11607, relevant ASTM and ISTA standards, and Quality System understanding and demonstrated use.
- Intermediate knowledge related to paperboard, corrugated, flexible packaging films, Tyvek, thermoformed trays, injection molded parts, and packaging equipment.
- Packaging process and equipment qualification experience.
- Understanding of quality system controls (e.g. user needs, design inputs/outputs, verification/validation, etc.)
- Travel approximately <10%
Preferred qualifications:
- Experience with manufacturing and/or distribution.
- Ability to solve complex problems with root cause analysis, including designing and executing experimental plans and using statistical methodologies to drive data-based decisions.
- Strong interpersonal skills: ability to build relationships and collaborate with global teams.
- Organized and results-oriented; ability to manage multiple projects and prioritize competing tasks.
- Strong communication skills (verbal & written) and presentation skills; ability to communicate with individuals on all levels.
- Ability to work independently to plan, schedule, and execute activities necessary to meet project timelines.
- Critical-thinking and problem-solving skills are required.
Maximum Salary: $ 144400
Compensation fornon-exempt (hourly), non-sales rolesmay also include variable compensation from time to time (e.g., any overtime and shift differential) and annual bonus target (subject to plan eligibility and other requirements).
Compensation forexempt, non-sales rolesmay also include variable compensation, i.e., annual bonus target and long-term incentives (subject to plan eligibility and other requirements).
For MA positions: It is unlawful to require or administer a lie detector test for employment. Violators are subject to criminal penalties and civil liability.
Please be advised that certain US based positions, including without limitation field sales and service positions that call on hospitals and/or health care centers, require acceptable proof of COVID-19 vaccination status. Candidates will be notified during the interview and selection process if the role(s) for which they have applied require proof of vaccination as a condition of employment. Boston Scientific continues to evaluate its policies and protocols regarding the COVID-19 vaccine and will comply with all applicable state and federal law and healthcare credentialing requirements. As employees of the Company, you will be expected to meet the ongoing requirements for your roles, including any new requirements, should the Company’s policies or protocols change with regard to COVID-19 vaccination.
Among other requirements, Boston Scientific maintains specific prohibited substance test requirements for safety-sensitive positions. This role is deemed safety-sensitive and, as such, candidates will be subject to a prohibited substance test as a requirement. The goal of the prohibited substance testing is to increase workplace safety in compliance with the applicable law.
These jobs might be a good fit
Job Description:
Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.
Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms.
The ideal candidate will have to drive strategic development activities and work closely with internal and external customer organizations to plan, execute and communicate development activities and programs.
The team leverages both experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids.
The team typically uses a combination of simulations and experiments, as needed, to help solve practical engineering problems.
The team frequently leverages advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches.
Note:This role requires regular onsite presence to fulfill essential job responsibilities. Provides tactical and strategic operational support to ensure the successful development and ramp of a high volume or technology development fabrication facility.
The ideal candidate should exhibit the following skills or behavioral traits:
Demonstrated ability to work seamlessly between experiments and simulations.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and orschoolwork/classes/research.
Minimum Qualifications:
- Master's Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics and 3+ years of relevant experience
- -OR- PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related fieldwith emphasis in solid mechanics
Preferred Qualifications:
Experience with multi-physics simulations, including coupledelectro-thermal-mechanicalanalysis, free surface two phase flows, electroplating and plasma.
Experience with designing, planning and executing experiments, along with interpretation of results.
Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows.
Strong understanding of advanced packaging technologies, familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow.
Programming/script development with artificial intelligence and machine learning concepts.
Previous related work experience in asemiconductor foundry preferred
Position of Trust
offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US: 100,160.00 USD - 193,390.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.These jobs might be a good fit
