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Responsibilities include:
* Develop resource forecasts aligned with product roadmap and program schedules
* Prioritize projects to meet deadlines while optimizing team workload distribution
* Track and analyze program metrics to guide design and production planning* Oversee quarterly department wide budget planning and submission process
* Analyze business processes and create resource models to determine staffing needs
* Own design studio operations including: scheduling team meetings, coordinating with facilities, maintaining studio and printer supplies
* Build and maintain relationships with global vendors, including training coordination and performance monitoring
* Coordinate press checks between internal teams and external partners, managing print sample archives
* Implement and optimize digital tools, including Digital Asset Management (DAM) and Program Management systems
* Establish and improve Standard Operating Procedures (SOPs)
- Bachelor’s degree in Business, Graphic Arts, Marketing, Advertising, or related studies
- 3+ years of packaging studio management, creative traffic management, or equivalent experience
* Experience in packaging and/or print artwork development
* Strong expertise in managing complex projects
* Experience with web-based project management software (Wrike, WorkFront or similar productivity tools)
* Proficient with Excel and Word
* Familiarity with Adobe CS (Illustrator, InDesign, Photoshop, and Acrobat)
* Excellent written and oral communication skills, as well as ability to problem-solve effectively
* Demonstrated ability to work in a fast-paced, ambiguous, deadline-driven work environment
* Ability to earn trust, engage, and influence people and teams at every level in the organization
* Can easily shift from thinking big to rolling up your sleeves to execute smaller tasks
* Ability to multi-task and manage a high volume of packaging activities with constant changes
* Enthusiasm for getting “hands on” in collaborative team environments
* Proven ability to balance long-term visioning with immediate needs
* Experience in consumer electronicsPursuant to the San Francisco Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records.
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The Role:
As Senior IC Packaging Manufacturing and Reliability Engineer, you will engage with an experienced cross-disciplinary staff to conceive and deliver innovative product IC package solutions. You will work closely with an internal inter-disciplinary team, and third party suppliers to drive key aspects of product definition, execution and optimization. You must be responsive, flexible and able to succeed within an open collaborative peer environment.As a member of the packaging team, you will be responsible for package definition, manufacturing and reliability for mm-wave beamforming SoCs and front-end modules. Strong focus will be on creating the most reliable, lowest cost package for a given system use case.In this role you will:
• Drive IC packaging design and manufacturing from NPI to volume production
• Drive production yield improvement through regular review of supplier key process parameters
• Work with package vendors to define package architecture options, BOM selection, and design rule libraries
• Generate packaging drawings and a set of standard package assembly operating procedures required at NPI and production stages
• Engage material, substrate and OSAT vendors to drive roadmaps, and identify technology candidates to reduce cost and improve package performance
• Define detailed package reliability test plans, based on applicable acceleration models and expected use-case conditions
• Define and drive package qualifications, including MSL, BHAST, HTS, TC, and BLR
• Troubleshoot package qualification and manufacturing issues, drive root cause failure analysis, and lead issues to resolution
• Define key performance indicators, and perform deep-dive audits at vendor sites (assembly, substrate, raw materials) to down-select candidates and/or drive issue resolution
• Analyze cost/performance trade-offs for various package architectures, including FCBGA, FCCSP, FOWLP, WLCSP, etc.
• Collaborate with the antenna, EE and mechanical teams to design and layout test vehicles and application PCBs for your packagesExport Control Requirement:
• Bachelor's degree in Engineering (Materials, Chemical, Mechanical) or other technical fields
• 7+ years in manufacturing full-custom packages for high performance chips
• Proven track record of delivering complex IC packages from design through to volume production
• Understanding of package material properties related to high-volume production and reliability: temperature cycling, HAST, shock, vibration, thermal resistance, outgassing, etc.
• Experience with package qualification, manufacturing, and continuous improvement
• Advanced degree in Engineering (Materials, Chemical, Mechanical) or other technical field
• 10+ years in manufacturing full-custom packages for high performance chips
• Proven track record of supporting products through volume production
• Strong understanding of package design, roadmaps, and manufacturing, and experience on-boarding new manufacturing partners (assembly, substrate, raw materials)
• Experience delivering various package technologies, including FCBGA, FCCSP, WLCSP, FOWLP packages
• Experience with working with OSAT suppliers and drove packaging issues to closure
• Well versed in package qualification test methodology, acceleration model definition and failure analysis
• Strong written and verbal skills
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(TOR) switches all the way through web scale data centers and across serviceprovider, enterprise networks, and data centers with a fully unified routing anddesigning, developing and testing some of the most complex ASICs being developedin the industry.
You will participate in the ASIC design verification for Cisco high-end switchingProducts, one of the largest and most sophisticated of its kind in the industry. You willuse the microarchitecture and define the verification plan and be responsible for theentire verification process.
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About the role: As advanced packaging continues to grow in importance, ensuring that PBG can offer leading advanced packaging solutions across 2D, 2.5D/3.5D, and 3D is critical. This role will be responsible for leading the ongoing analysis of the IFS Advanced Packaging roadmap vs external competitive offerings and providing regular updates to both PBG and ATTD management.
The role requires close collaboration with ATTD partners to understand internal offerings and review external research on third-party developments to ensure that PBG creates and maintains an industry-leading portfolio.
Responsibilities include but not limited to:
Work with TD partners to ensure the TD roadmap is aligned with competitor offerings and suggest roadmap adjustments.
Monitor market trends andadvisepackaging strategy adjustments based on market trends.
Partner with Front-End team in IFS to ensure that 2.5D / 3D / 3.5D solutions maximize internal base-die benefits
You mustbelow minimum education requirementsand minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience.preferred qualifications are in addition to therequirements and are considered a plus factor in
Minimum Qualifications:
Bachelor’s Degree with9+ years of experience, OR Master’s Degree with6+ years of experience, ORPHD inComputer Engineering, Electrical Engineering, Physics, Chemistry, or other related field, with 4+ years of experience in semiconductor packaging and customer engagement
2+ years of experience in customer and client services at a senior management level, including regularly providing strategic recommendations to Intel VPs and Corporate VPs, with proventrack recordof effectively presenting insights and proposals to senior management, ensuring alignment with organizational goals,and fostering strong executive relationships.
2+ years of experiencepresenting insights and recommendations to senior management, including VPs and Corporate VPs.
Preferred Qualifications:
nalyzing and integrating key attributes of 2D, 2.5D/3.5D, and 3D architectures from a customer perspective, including benchmarking against external plans and recommending changes to enhance design effectiveness and customer satisfaction.
Master’s degree or PhD degree in Engineering or an MBA.
Evaluating the external packaging landscape andidentifyingkey competitors, enhancing competitive positioning and market strategy.
eveloping and applying mental models of value creation specific to packaging services and products, with a focus on strategic planning and execution.
Weoffer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US:
This role is available as a fully home-based and generally would require you to attend Intel sites only occasionally based on business need. This role may also be available as our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change. The application window for this job posting is expected to end by 04/04/2025
These jobs might be a good fit

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These jobs might be a good fit