Analog Ic Design Manager - Custom Power Products Santa Clara jobs at Texas Instruments

In this role, responsibilities may include:

• Drive system level and transistor level design of high performance switching regulators, translating system requirements to chip and block level architecture and specifications
• Perform detailed analysis of switching regulator efficiency, electro-migration, thermal management.
• Debug complex use case conditions to isolate root cause
• Lead an Analog IC design team with product ownership and responsibility from definition to release to manufacturing
• Make assignments for team members, providing design guidance as needed, developing schedules and monitoring progress throughout the project
• Work with and provide guidance to physical designers and monitors the progress of IC layout
• Evaluate system-level use-cases and re-create these in simulation
• Interface and lead discussions with the customer to understand customer designs, problems and support as required
• Collaborate with validation, product engineering and test engineering teams to enable successful transfer to production

Minimum requirements:

• Master's degree in Electrical Engineering
• Minimum 5+ years of relevant experience
• Extensive background in Power IC design

Preferred qualifications:

• Extensive experience in switching DCDC regulators design e.g. multi-phase buck, boost and buck-boost converters. Deep understanding of different control architectures.
• Deep understanding of power stage design and layout including gate drivers, fault systems and power FETs.
• Experience working with layout team on block and top level floor-planning
• Knowledge of device physics and process technologies tradeoffs that are applicable to Power IC design
• Expertise in tools e.g. Spectre, Simplis, Matlab and AMS
• Strong verbal and written communication skill
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery
• Ability to work in teams and collaborate effectively with people in different functions
• Demonstrated ability to build strong, influential relationships
• Working well in a team environment is imperative in this role

Why TI?

· Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.

· We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours.

· Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.

In this role, responsibilities may include:

• Lead an Analog IC design team with product ownership and responsibility from definition to release to manufacturing
• Direct, guide and participate in activities of a research or technical design function responsible for designing, developing, modifying and evaluating electronic parts, components, integrated circuits for a variety of applications
• Make assignments for team members, providing design guidance as needed, developing schedules and monitoring progress throughout the project
• Evaluate intermediate and final results of projects during the design phase and during silicon evaluation, to ensure accomplishment of technical objectives
• Work with and provide guidance to physical designers and monitors the progress of IC layout
• Collaborate with Design Verification teams during the pre-PG phase of a project to ensure completion of all technical tasks before PG
• Work with systems engineers, application engineers and marketing to prepare product briefs, datasheets, application notes and assisting in the definition of the product to meet customer needs as well as contributing to roadmap formulation and new concept creation
• Collaborate with validation, product engineering and test engineering teams to enable successful transfer to production
• Interface and lead discussions with the customer and/or TI field sales/field applications teams to understand customer designs, problems and support as required
• Actively participate in hiring, developing and evaluating personnel to ensure efficient operation of the organization and growth of the individuals into leader

Minimum requirements:

• Bachelor's degree in Electrical Engineering or related
• 7+ years of relevant experience

Preferred qualifications:

• Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
• Strong verbal and written communication skills
• Ability to quickly ramp on new systems and processes
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery

Texas Instruments is seeking a Process Development Engineering Manager. In this role, you will lead and oversee the integration and development of the overall BEOL in advanced lithography nodes, such as 28nm and beyond. Primary responsibilities will include (a) ownership of the process flow for BEOL that meets physical, electrical, yield and reliability targets; (b) working closely with the unit process development group to design experiments to evaluate multiple integration options and arrive at an optimized, manufacturable and cost effective solution; (c) partnering with the RET team to validate OPC and make improvements, as appropriate; (d) collaborating with the silicon-package-test interaction (SPTI) team to ensure silicon process is compatible with test and packaging robustness requirements. As part of this role, you will have direct and indirect people responsibilities, and will be accountable for delivering technology solutions on time that meet product requirements.

Minimum requirements:

• Master’s degree in electrical engineering
• 10 years of experience in 28nm or related technology with hands-on experience developing BEOL

Preferred qualifications:

• Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
• Strong verbal and written communication skills
• Ability to quickly ramp on new systems and processes
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery

Texas Instruments is seeking a High Voltage Packaging Engineering Manager. In this role, you will direct development of new package/container requirements and oversee the quality of existing packages/containers for all product groups. You may also develop designs to meet requirements needed for the nature of the product, transportation methods, cost considerations, legal requirements, and package content characteristics. You will consider the need for resistance to external variables such as temperature variations, light, moisture, and corrosive chemicals. You may oversee the coordination of activities at contract packaging and labeling sites. An additional job function includes overseeing exterior package design to ensure proper product identification, consumer appeal, printing appearance, and production techniques. The role requires current knowledge of hazards and safety protocols for safe handling, transportation, and use of products. As a High Voltage Packaging Engineering Manager, you may also select, develop and evaluate personnel to ensure the efficient operation of the function.

Responsibilities of the team may include:

• Define, design, develop and scale to volume production high voltage (200-3300V) packages and high-power modules for the Industrial, Automotive, Renewable and Telecom markets
• Understand market trends & end equipment system requirements and build these into competitive forward-looking package and module roadmaps
• Define solutions across various HV technologies like GaN, SiC, IGBT and Isolation Technologies and validate these using CFD, thermomechanical and electrical parasitic extraction tools
• Develop new process flows/technologies necessary to create 1^starticle prototype and also scale to high volume manufacturing
• Outline the package reliability plans, complete testing, summarize failure modes and provide solutions to address issues
• Build upon current knowledge of the material supplier landscape (mold compounds, die attach, substrates) for high voltage applications as well as process / equipment integration and must work with various suppliers to provide solutions to meet TI roadmaps
• Work collaboratively across worldwide cross functional teams and capable of accelerating development cycles and ensuring rapid time-to market for new products

Minimum requirements:

• Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering or related engineering degree
• 10 + years of experience and proven track record of innovation in High Voltage (200V-3300V must) and high power (5KW – 300KW) semiconductor packaging across GaN / SIC / IGBT, Super Junction MOSFET technologies
• Experience as a Manager for high voltage package and power module design, materials, equipment, and assembly flow integration (molded packages like TOLT, TOLG, Q-DPAK DIP, SIP and case modules)
• Strong knowledge of Silicon / GaN / SiC-package interaction and hands on experience with stress, thermal and electrical modeling analysis and tools

Preferred qualifications:

• Excellent communication skills and ability to work with internal and external customers to define and develop roadmaps
• Prior experience scaling HV packages and modules from concept to high volume manufacturing
• Good understanding of clip attach, flip chip packaging and overview of wafer bumping processes
• Knowledge of magnetics and high power density enterprise power modules (6V – 48V) is a plus
• Strong knowledge of HV Bill of Materials (Mold compounds, Die Attach, DBC substrates, etc.)
• Good understanding of industry & subcon HV packaging capabilities & roadmaps
• Overview of high voltage discrete and power modules reliability and qualification requirements, proven ability to define and drive reliability and qualification strategies in alignment with these standards and problem solving
• Track record of presenting at international conferences or symposiums related to power electronics, semiconductor packaging, or high-voltage technologies

Key Responsibilities:

Technical Leadership:

• Oversee the design, development, and verification of analog and mixed-signal circuits for flash memory development, including charge pumps, voltage regulators, sense amplifiers, and memory interfaces
• Define and review circuit architectures to optimize performance, power, and area (PPA)
• Drive innovation in circuit design to address industry challenges in scaling, performance, and reliability for flash
• Provide technical guidance and direction to team members, ensuring timely project execution
• Collaborate with world-wide cross-functional teams, including layout, process, test engineering, and product teams
• Ensure designs meet technical specifications, project timelines, and quality standards
• Identify and mitigate design risks, ensuring robust circuit performance under process, voltage, and temperature (PVT) variations

Collaboration and Communication:

• Interface with Process teams (Process Integration Engineers) to optimize technology for flash/NVM applications
• Present project updates, technical reviews, and status reports to stakeholders and senior management

Innovation and Continuous Improvement:

• Stay updated on industry trends, emerging technologies, and best practices in embedded flash and analog design
• Drive continuous improvement in design methodologies, tools, and workflows

Minimum Qualifications:

• Bachelor’s degree in Electrical Engineering, Microelectronics, or a related field of study
• 5 + years of experience in analog/mixed-signal circuit design, with a focus on embedded flash development complex designs
• Deep understanding of NVM/embedded flash operation, including programming, reading, and reliability considerations
• Working experience with various analog building blocks, such as current mirrors, operational amplifiers, sense amplifiers, charge pumps, oscillators, and LDOs
• Proficient in design and simulation tools (e.g., Cadence Virtuoso, SPICE, extraction tools)
• Familiarity with process technology and layout considerations for advanced nodes (28nm)
• Device physics experience, related to reliability and device behavior over PVT
• Scripting language experience, such as PERL

Preferred Qualifications:

• Experience in silicon bring-up, debug, and characterization
• Knowledge of reliability challenges such as endurance, retention, and soft errors in flash/NVM
• Demonstrated strong analytical and problem-solving skills
• Strong verbal and written communication skills
• Ability to work in teams and collaborate effectively with people in different functions
• Strong time management skills that enable on-time project delivery
• Demonstrated ability to build strong, influential relationships
• Ability to work effectively in a fast-paced and rapidly changing environment
• Ability to take the initiative and drive for results

As a member of Kilby Labs you’ll have the chance to interact with many product groups and functions, work with an interdisciplinary team, and bridge from lab to fab to develop technologies to enable new markets.

About the Position

Kilby Labs is seeking a highly motivated and experienced Silicon Photonics High-Speed Design Engineer to be a key contributor to the development and implementation of innovative high-speed data communications solutions for cutting-edge optical products including silicon photonics ICs, optical engines, and co-packaging of optics. You will be responsible for the design, processing, and volume productization of silicon photonics high speed Tx photonic integrated circuits (PICs) and their integration within state-of-the-art datacom transceivers.The role includes working closely with process, architecture, test, and product engineering teams to ensure successful product development and launch. The role requires a creative problem-solver who can develop unique, breakthrough technologies that leap-frog the state of the art as well as contribute across various aspects of a project depending on project needs.

Responsibilities may include, but are not limited to:

• Design and optimize high-speed Si photonics modulator and transmit PIC solutions for next-generation datacom products.
• Work closely with high speed electronics, architecture, systems, and packaging design teams to develop co-designed optical engine solutions that meet system performance requirements
• Develop and implement volume-product-ready solutions that are power and cost efficient contributing to the development of the launch of datacom transceiver products
• Work closely with process and layout teams to develop PICs based on both fixed and customized Si fabrication processes.
• Plan and execute design and process optimization, characterization, and design validation for continuous improvement for volume production.
• Work with characterization and test teams to analyze performance data, identify areas for improvement, and assist with development of high-volume test procedures.
• Design and optimize other PIC components, such as waveguides, couplers, and filters.
• See designs through to mass production by collaborating with product engineering and operations teams.
• Drive cost and power reduction generational improvements.
• Participate in R&D to develop next generation photonics technologies, drive IP development.
• Present work and findings to internal and external stakeholders.

Minimum Requirements:

• Master’s or PhD degree in Electrical Engineering, Physics, Applied Physics, Photonics, Optical Communications or related field.
• 5+ years of industry experience designing Si photonics high-speed modulator PICs, including modeling and designing advanced high-speed Si MZMs, for datacom transceiver qualified volume products.
• Deep understanding of silicon photonics high speed device physics and fabrication processes.
• Strong understanding of PIC design, layout, and fabrication, and experience contributing to or leading PIC tapeouts.
• Familiarity with advanced modulation formats (e.g. PAM4) and linearization techniques.
• Experience with photonic design and CAD tools.
• Experience with characterization and testing of high-speed photonic devices.
• Ability to work both independently and as part of a team.

Preferred Qualifications:

• Experience with a range of modulator technologies e.g. Si ring resonator (MRR) modulators, EAM modulators, and non-Si modulator materials.
• Experience with co-design of photonics with analog-front-end electronics.
• Experience with technical approaches for next-gen (beyond 200 Gb/s/lane) modulator technologies and modulation formats.
• Experience with TOSA optical engine design and packaging and assembly of photonic devices.
• Knowledge of optical communication systems and standards.
• Understanding of the end applications related optical networking, including pluggable modules and co-packaged optics.
• Strong verbal and written communication skills.
• Ideal candidate must also excel at promoting new ideas, building collaborative relationships, working across organizations.

In this role, responsibilities may include:

• Lead an Analog IC design team with product ownership and responsibility from definition to release to manufacturing
• Direct, guide and participate in activities of a research or technical design function responsible for designing, developing, modifying and evaluating electronic parts, components, integrated circuits for a variety of applications
• Make assignments for team members, providing design guidance as needed, developing schedules and monitoring progress throughout the project
• Evaluate intermediate and final results of projects during the design phase and during silicon evaluation, to ensure accomplishment of technical objectives
• Work with and provide guidance to physical designers and monitors the progress of IC layout
• Collaborate with Design Verification teams during the pre-PG phase of a project to ensure completion of all technical tasks before PG
• Work with systems engineers, application engineers and marketing to prepare product briefs, datasheets, application notes and assisting in the definition of the product to meet customer needs as well as contributing to roadmap formulation and new concept creation
• Collaborate with validation, product engineering and test engineering teams to enable successful transfer to production
• Interface and lead discussions with the customer and/or TI field sales/field applications teams to understand customer designs, problems and support as required
• Actively participate in hiring, developing and evaluating personnel to ensure efficient operation of the organization and growth of the individuals into leader

Minimum requirements:

• Bachelor's degree in Electrical Engineering
• 15+ years of relevant experience

Preferred qualifications:

• Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
• Strong verbal and written communication skills
• Ability to quickly ramp on new systems and processes
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery