Advanced Process Controls Engineer Smfab jobs at Texas Instruments

In this role, responsibilities may include:

• Drive system level and transistor level design of high performance switching regulators, translating system requirements to chip and block level architecture and specifications
• Perform detailed analysis of switching regulator efficiency, electro-migration, thermal management.
• Debug complex use case conditions to isolate root cause
• Lead an Analog IC design team with product ownership and responsibility from definition to release to manufacturing
• Make assignments for team members, providing design guidance as needed, developing schedules and monitoring progress throughout the project
• Work with and provide guidance to physical designers and monitors the progress of IC layout
• Evaluate system-level use-cases and re-create these in simulation
• Interface and lead discussions with the customer to understand customer designs, problems and support as required
• Collaborate with validation, product engineering and test engineering teams to enable successful transfer to production

Minimum requirements:

• Master's degree in Electrical Engineering
• Minimum 5+ years of relevant experience
• Extensive background in Power IC design

Preferred qualifications:

• Extensive experience in switching DCDC regulators design e.g. multi-phase buck, boost and buck-boost converters. Deep understanding of different control architectures.
• Deep understanding of power stage design and layout including gate drivers, fault systems and power FETs.
• Experience working with layout team on block and top level floor-planning
• Knowledge of device physics and process technologies tradeoffs that are applicable to Power IC design
• Expertise in tools e.g. Spectre, Simplis, Matlab and AMS
• Strong verbal and written communication skill
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery
• Ability to work in teams and collaborate effectively with people in different functions
• Demonstrated ability to build strong, influential relationships
• Working well in a team environment is imperative in this role

Why TI?

· Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.

· We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours.

· Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.

In this role, responsibilities may include:

• Lead an Analog IC design team with product ownership and responsibility from definition to release to manufacturing
• Direct, guide and participate in activities of a research or technical design function responsible for designing, developing, modifying and evaluating electronic parts, components, integrated circuits for a variety of applications
• Make assignments for team members, providing design guidance as needed, developing schedules and monitoring progress throughout the project
• Evaluate intermediate and final results of projects during the design phase and during silicon evaluation, to ensure accomplishment of technical objectives
• Work with and provide guidance to physical designers and monitors the progress of IC layout
• Collaborate with Design Verification teams during the pre-PG phase of a project to ensure completion of all technical tasks before PG
• Work with systems engineers, application engineers and marketing to prepare product briefs, datasheets, application notes and assisting in the definition of the product to meet customer needs as well as contributing to roadmap formulation and new concept creation
• Collaborate with validation, product engineering and test engineering teams to enable successful transfer to production
• Interface and lead discussions with the customer and/or TI field sales/field applications teams to understand customer designs, problems and support as required
• Actively participate in hiring, developing and evaluating personnel to ensure efficient operation of the organization and growth of the individuals into leader

Minimum requirements:

• Bachelor's degree in Electrical Engineering or related
• 7+ years of relevant experience

Preferred qualifications:

• Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
• Strong verbal and written communication skills
• Ability to quickly ramp on new systems and processes
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery

Job Description:

Kilby Labs is looking for abiomedical systems/applications engineer to do research and development on

Integrated semiconductor-based sensing technology’s applications range from industrial sensor applications to future of point of care diagnostic tools and wearables. Decentralized healthcare requires more accurate, portable, and multiplexed diagnostic tools. We are looking for biomedical sensor experts to do research and development on electrochemical/magnetics/optical/ultrasound-based sensors to enable breakthroughs in this field. Key responsibilities include • Develop semiconductor-based biomedical sensing technology roadmap • Validate and benchmark sensor chips • Identify and engage service providers for functionalization of sensor surface• Work with customers to define concepts and prototypes towards product • Work with internal product teams to productize research prototypes

Responsibilities may include:

• Research and create new product definitions, including developing business case proposals, product strategies and taking products to market
• Analyze and identify trends in clinical and consumer grade medical point of care devices, identifying opportunities for improving performance and adding value to these systems
• Assess and negotiate IC development tradeoffs with design team and customers
• Be the technical expert, responsible for product ramp up at the customer
• Silicon system evaluation (HW, SW if needed) and related documentation
• Application support for prototypes, newly introduced and existing products
• Support and train central applications engineering and sales organizations on new/existing products
• Relentlessly drive new design wins for new and existing products
• Trouble-shoot customer application issues by lab testing, schematic analysis and other methods, as necessary
• Bring quick resolution to customer problems by interfacing across different functional groups such as design, product, test, packaging, marketing and sales
• Assist with generating the revenue plan for the organization
• Definition of successful new products at TI, system evaluation and taking the products to market
• Create technical literature such as datasheets, application notes, EVM user's guides, spice models etc.
• Drive Revenue growth through promotion of new and existing products
• Build relationships with customers/field teams by closely interacting with them to identify and solve system problems with TI silicon
• Contribute to the short- and long-term product strategy and roadmap

Minimum requirements:

• Masters/Ph.D. in Electrical Engineering, Biomedical Engineering or related field.
• 5+ years of relevant experience

Preferred requirements:

• Strong biomedical sensing background
• Good understanding of analog/mixed-signal IC’s and their applications
• Experience promoting/marketing ICs and driving design wins by providing system solutions
• Strong customer-facing skills
• Familiarity with lab equipment and silicon validation
• System level circuit modeling with EDA tools, SPICE, Matlab
• Background on electrochemical and/or point of care wearable or diagnostic devices
• Knowledge of industry trends, industry standards, supply chain, and reliability requirements.
• Participation in international Standards committee, publication record in field related journals, magazines or conferences. Ability to establish strong relationships with key stakeholders, both internally and externally
• Strong verbal and written communication skills
• Ability to quickly ramp on new systems and processes
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take initiative and drive for results

This position will be located in Dallas, Texas

Why TI?

• Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
• We’re different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours.
• Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.

At TI, System Engineers work to identify ideal roadmap opportunities for a business and are responsible for defining new products and platforms based on market opportunity. To do this, they leverage strong technical knowledge of our existing portfolio, deep understanding of the technologies, standards and protocols within an industry or end equipment, and an ability to engage with customers and translate their requirements into technical specifications that will solve their problems. Systems engineers also partner closely with marketing and applications engineers, as well as design teams, to ensure our roadmap is both meeting customer and market requirements and is technically optimized and manufacturable at a price and cost point that makes sense for the business.

In this system engineer role, you’ll have the chance to:

• Lead cutting edge R&D projects that have a direct impact on the businesses in TI. Help imagine, define, create and collaborate with the business groups find high value innovations that solve challenging problems.
• Development of highly differentiated power circuits for Power Management Regulators or controllers
• Competitive benchmarking and tracking latest research in the domain of innovative power management architecture and circuits
• Balancing innovation with execution - to ensure that the IPs are demonstrated in silicon in a timely manner
• Working in close collaboration with Process, Packaging, BU partners and other Kilby team members
• Supporting the technology transfer and productization of the innovative IPs developed by the team
• Industry champion/liaison of university research projects in the area of power management
• Interface and lead discussions with the customer and/or TI field sales/field applications teams to understand customer designs, problems and support as required

Minimum requirements:

• PhD degree in Electrical Engineering with emphasis on Power Electronic Systems
• Minimum Cumulative 3.5/4.0 GPA
• Detailed understanding of DC-DC Isolated and non-isolated power converter topologies, soft switching techniques and Power Devices.
• Understanding of mixed signal integrated circuit design targeting power management is a plus
• Strong knowledge of high frequency magnetics design for power electronics
• Familiarity with EM simulation software ( like HFSS) for magnetics design
• Excellent knowledge of control theory, closed loop compensation, stability analysis, phase margin, etc
• Experience with circuit modeling and simulation tools (e.g. Simplis, PSpice etc.) required
• Proficiency with standard lab equipment
• Printed circuit board design experience is a must
• Knowledge of System Packaging or Power Module is a plus
• Proven track record as a strong team player

Preferred qualifications:

• Exceptional creative intuition for power electronics topologies and systems
• Demonstrated written communications skills through primary authorship of scientific journal and conference papers
• Ability to work with multiple cross functional teams to make the right trade-offs on system level performance
• Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
• Strong time management skills that enable on-time project delivery

Responsibilities include:

• Lead a cross functional team on the execution of releasing new products and ensuring successful return on investment for every development; the team consists of Design, Marketing, Systems& Applications, Validation, Product& Test Engineering, Firmware/Software Engineering, Manufacturing, Field, and Quality
• Work with wafer fabrication, assembly& test sites to guarantee schedule, cost and quality
• Plan the project using MS Project from Assess Opportunity Phase to Release to Market and is responsible to make sure the project comes in on budget
• Provide clear direction to both, team and external support organizations like device fabrication and assembly and test sites
• Drive and motivate all team members critical to the flawless execution of each product and project
• Provide weekly and monthly updates to senior management on status of projects, explaining the issues facing a project
• Interact with customers in support of project status, key milestones, and deliveries.
• Maintain thorough and up-to-date project schedules with all related milestones
• Communicate weekly to management on status of each project
• Success will be measured by the ability to grow the number of new products and drive the forecasted return on investment.

Minimum requirements:

• Bachelors in Electrical Engineering, Mechanical Engineering or related engineering degree
• 10 years of experience with project engineering/management experience on highly complex products/projects
• Proven leadership capabilities in leading multifaceted global organizations
• Successful proven track record in indirect management and influence
• Must be flexible to work within US, India, European and Asian business hours

Preferred qualifications:

• Ability to manage multiple projects simultaneously, and set realistic plans based on required tasks with available resources
• Ability to effectively coordinate and lead global development teams on projects that include design, silicon fabrications, production test development, qualification and production ramp; Programs will be driven out of multiple global locations
• Ability to provide clear direction to both internal teams and external support organizations like device fabrication and assembly sites
• Ability to work in a team environment and understand cross-functional team dynamics
• Ability to work with global customers to align project schedules with customers' key milestones
• Demonstrated strong analytical and problem solving skills
• Strong verbal and written communication skills
• Ability to work in teams and collaborate effectively with people in different functions
• Strong time management skills that enable on-time project delivery
• Demonstrated ability to build strong, influential relationships
• Ability to work effectively in a fast-paced and rapidly changing environment
• Ability to take the initiative and drive for results

Texas Instruments is seeking a Process Development Engineering Manager. In this role, you will lead and oversee the integration and development of the overall BEOL in advanced lithography nodes, such as 28nm and beyond. Primary responsibilities will include (a) ownership of the process flow for BEOL that meets physical, electrical, yield and reliability targets; (b) working closely with the unit process development group to design experiments to evaluate multiple integration options and arrive at an optimized, manufacturable and cost effective solution; (c) partnering with the RET team to validate OPC and make improvements, as appropriate; (d) collaborating with the silicon-package-test interaction (SPTI) team to ensure silicon process is compatible with test and packaging robustness requirements. As part of this role, you will have direct and indirect people responsibilities, and will be accountable for delivering technology solutions on time that meet product requirements.

Minimum requirements:

• Master’s degree in electrical engineering
• 10 years of experience in 28nm or related technology with hands-on experience developing BEOL

Preferred qualifications:

• Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
• Strong verbal and written communication skills
• Ability to quickly ramp on new systems and processes
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery

As a member of our Packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.
Responsibilities may include:

• To define, design, develop and scale to volume production high voltage (200-3300V) packages and high-power modules for the Industrial, Automotive, Renewable and Telecom markets.
• The candidate must understand market trends & end equipment system requirements and build these into competitive forward-looking package and module roadmaps.
• The candidate must have the ability to define solutions across various HV technologies like GaN, SiC, IGBT and Isolation Technologies and validate these using CFD, thermomechanical and electrical parasitic extraction tools.
• The candidate will develop new process flows/technologies necessary to create 1^starticle prototype and also scale to high volume manufacturing.
• The candidate should outline the package reliability plans, complete testing, summarize failure modes and provide solutions to address issues.
• The candidate must have a broad knowledge of the material supplier landscape (mold compounds, die attach, substrates) for high voltage applications as well as process / equipment integration and must work with various suppliers to provide solutions to meet TI roadmaps.
• The candidate must be a proven leader, capable working collaboratively across worldwide cross functional teams and capable of accelerating development cycles and ensuring rapid time-to market for new products.

Minimum Requirements:

• Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering or related engineering degree
• 10 + years of experience and proven track record of innovation in High Voltage (200V-3300V must) and high power (5KW – 300KW) semiconductor packaging across GaN / SIC / IGBT, Super Junction MOSFET technologies
• Hands on high voltage package and power module design, materials, equipment, and assembly flow integration (molded packages like TOLT, TOLG, Q-DPAK DIP, SIP and case modules)
• Strong knowledge of Silicon / GaN / SiC-package interaction and hands on experience with stress, thermal and electrical modeling analysis and tools

Preferred Requirements:

• Excellent communication skills and ability to work with internal and external customers to define and develop roadmaps
• Prior experience scaling HV packages and modules from concept to high volume manufacturing
• Good understanding of clip attach, flip chip packaging and overview of wafer bumping processes
• Knowledge of magnetics and high power density enterprise power modules (6V – 48V) is a plus
• Strong knowledge of HV Bill of Materials (Mold compounds, Die Attach, DBC substrates, etc.)
• Good understanding of industry & subcon HV packaging capabilities & roadmaps
• Overview of high voltage discrete and power modules reliability and qualification requirements, proven ability to define and drive reliability and qualification strategies in alignment with these standards and problem solving
• Track record of presenting at international conferences or symposiums related to power electronics, semiconductor packaging, or high-voltage technologies