Manufacturing Process Engineer New Grad jobs at Texas Instruments in Japan

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【入社一年目にUS本社研修あり】
技術営業部に入社する新卒入社向けFAST (Field Applications & Sales Training) トレーニングプログラムを実施します。
技術的なスキルとビジネスの視点を組み合わせた、セールスのキャリア向けに作られたプログラムとなっています。そのプログラムを通じて、TI のビジネス成長に貢献し、TI でのキャリアを通じて活躍できるような経験を得ることができます。

東京本社 ：東京都港区港南1-2-70　品川シーズンテラス31F
名古屋営業所：愛知県名古屋市中区錦 2-4-3　錦パークビル 17階
大阪営業所　：大阪府大阪市淀川区宮原4-5-41　新大阪第2NKビル9F

交通費、宿泊費：支給あり（当社規定に基づき支給します。）
報酬：日当支給（9600円/日）

理系学生
★こんな人におすすめ
BtoBビジネス、半導体業界や先進技術に関わる業界に関心がある方
電気・電子の基礎知識がある方
メーカーの営業的側面を学びたい方
英語を活かして仕事を経験したい方（TOEIC600点以上）

Packaging engineers play an important role at TI which encompasses the following responsibilities:

• Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness
• Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage
• Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages.
• Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs.

Minimum Requirements:

• Student whowill graduate in 2025 or 2026 or graduated in 2024 or 2025
• Bachelors degree in Material Science, Mechanical Engineering, Chemical Engineering, Polymer Science or Physics, Electrical Engineering
• Fluent in Japanese
• Communication skill

Preferred Qualifications:

• Master degree
• Study about inductor, coil, magnetics and motor. Simulation experience with Ansys or original model.

【アナログ FAE 担当領域】アナログ製品(アンプ、AD/DAコンバーター、通信IC、電源IC、ドライバIC、クロック、インターフェース等)を担当【デジタル FAE 担当領域】・デジタル製品(マイコンやプロセッサ、及び無線通信用ICといったソフトウェアを組み込んで動作させるIC等)を担当【入社一年目にUS本社研修あり】技術営業部に入社する新卒入社向けFAST (Field Applications & Sales Training) トレーニングプログラムを実施します。技術的なスキルとビジネスの視点を組み合わせた、セールスのキャリア向けに作られたプログラムとなっています。そのプログラムを通じて、TI のビジネス成長に貢献し、TI でのキャリアを通じて活躍できるような経験を得ることができます。

【募集条件】・理工系学部卒以上・TOEIC600 点以上程度の英語力がある方、日本語ビジネスレベル以上【アナログ FAE 担当領域】・電気/電子回路の基礎知識と簡単なICを使った回路作成経験がある方【デジタル FAE 担当領域】・C言語を用いたプログラミング経験と、汎用/リアルタイムOSの使用経験(PCにLinuxをインストールし活用したなど)。

When you join TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI and set you up for long-term career success. Within this program, we also offer function-specific technical training and on-the-job learning opportunities that will encourage you to solve problems through a variety of hands-on, meaningful experiences from your very first day on the job.

This 7-month experience aims to teach Technical Sales Associates (TSAs) how to build and manage customer relationships, and how to influence decisions to grow TI's revenue. The track includes three rotations*:

Upon successful completion of this track in the FAST program, participants are welcomed as Technical Sales Representatives (TSRs) on TI's Worldwide Sales& Applications team. Technical Sales Representative responsibilities include:

• Using technical expertise, various sales tools and relationships with engineering teams to identify projects
• Managing and quantifying leads, and managing the commercial aspects of customer relationships
• Developing, forecasting and monitoring an annual plan for revenue growth

Minimum requirements:

• Student who will graduate in 2026
• Bachelors degree in Electrical Engineering, Computer Engineering, Electrical and Computer Engineering or related field
• Fluent in local language and English, both written and oral communication skills

Preferred qualifications:

• Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
• Strong verbal and written communication skills
• Ability to quickly ramp on new systems and processes
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery

The Emerging Packaging and Test Team at Texas Instruments is looking for a Magnetics and Passives Integration Technologist

• Lead the definition, development and realization of comprehensive low-profile inductors, planar magnetics, and integrated passives roadmaps to enable ultra-compact, high-density, high current (100-300A) power delivery modules for enterprise and AI infrastructure
• Develop strategic relationships and partnerships with leading suppliers worldwide to co-develop magnetic materials, inductors, capacitors, and packaging technologies that meet performance, reliability, and scaling needs.
• Ensure manufacturability, testability and reliability through early-stage DfX, material qualification, and close supplier collaboration.

Qualifications:

• MS or PhD in Electrical Engineering, Materials Science, or a related field with deep focus on magnetics and power packaging.
• 10+ years of hands-on experience in power inductor design supporting advanced power topologies, including TLVR & multiphase coupled inductors (upto 20MHz) with a track record of joint development, qualification, and scaling.
• System-level understanding of power delivery architectures, thermal management, EMI, and reliability constraints.
• Strong fundamentals in the physics of magnetic materials: ex. Stoner-Wohlfarth, Steinmetz models, Ollendorf models for composite materials, etc.
• Familiarity with high-frequency magnetic material behavior, loss modeling, and reliability testing. Hands on knowledge of simulation tools and techniques like Maxwell, Ansys, Femtet, homogenization and model order reduction, optimization tools (NN, AI/ML)
• Deep insights in magnetic supplier capabilities, roadmaps and emerging research
• In depth understanding of magnetic materials: Ferrite materials (NiZn MnZn), metal materials (Fe, FeNi, FeSiCr, FeSiAl, amorphous & nano crystalline materials)
• Material Characterization (ex; BH analyzer, VSM, SEM, EDX)
• Understanding of material processing: ceramic, metal powder and composite materials
• Familiarity with inductor coil forming and termination processes: wire wounded, multilayer, metal composite, thin film, etc.
• Experience in advanced co-packaged power modules
• Strong IP generation background in magnetics, packaging, or passive integration domains.

In this role, your responsibilities include:

• Help TI secure customer commitments and win business by working on-site with customers in support of their engineering teams developing applications
• Recommend and implement system processor solutions to customers in a consultative role have strong embedded software development skills
• Develop custom applications and example code for key customers
• Debug software components in the customers end systems
• Work closely with the sales team and product group to capture processor business and successfully take it to revenue
• Take customer designs to revenue by providing prompt and thorough support for on-going design activity
• Understand the competitive landscape; constantly applying lessons from customer engagement to refine this competitive understanding
• Use competitive knowledge to tailor feedback to the product group for new product/feature development
• Understand the specific business benefits that such feature/product enhancements will produce
• Define and develop software and systems application notes and collateral for the above mentioned devices
• Present at TI technical conferences and facilitate product specific customer trainings (seminars/workshops)

Minimum requirements:

• Bachelor's degree in EE/Comp Eng, or comparable
• Minimum 5 years of relevant experience
• Working understanding of applications with an emphasis on PC motherboard controllers and system management controllers
• Fluent in Japanese and English

Preferred qualifications:

• Strong verbal and written communication skills
• Strong presentation skills, with ability to effectively relate materials to customers
• Demonstrated strong analytical and problem solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery
• Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
• Demonstrated ability to build strong, influential relationships
• Ability to efficiently context-switch between multiple concurrent tasks
• Ability to advocate for customer needs (with an understanding of “why”) back into the TI product groups

The Emerging Packaging and Test Team at Texas Instruments is looking for a qualified candidate

• To lead a high-performing team of packaging technologists to define, design, develop and scale to volume production high voltage (200-3300V) packages and high power modules for the Industrial, Automotive, Renewable and Telecom markets.
• The candidate must understand market trends & end equipment system requirements and build these into competitive forward-looking package and module roadmaps
• The candidate must have the ability to define solutions across various HV technologies like GaN, SiC, IGBT and Isolation Technologies and validate these using CFD, thermomechanical and electrical parasitic extraction tools.
• The candidate will identify prototype/subcon partners, assess manufacturing capabilities and drive completion of 1^st
• The candidate should outline the package reliability plans, complete testing, summarize failure modes and provide solutions to address issues.
• The candidate must have a broad knowledge of the material supplier landscape (mold compounds, die attach, substrates) for high voltage applications as well as process / equipment integration and must work with various suppliers to provide solutions to meet TI roadmaps
• The candidate must be a proven leader and people manager, capable working collaboratively across worldwide cross functional teams and capable of accelerating development cycles and ensuring rapid time-to market for new products.

Qualifications:

• BS degree in Mechanical, Material Sciences, Electrical Engineering or related engineering degree
• 10+ years of experience and proven track record of innovation in High Voltage (200V-3300V must) and high power (5KW – 300KW) semiconductor packaging across GaN / SIC / IGBT, Super Junction MOSFET technologies.
• Excellent communication skills and ability to work with internal and external customers to define and develop roadmaps.
• Hands on high voltage package and power module design, materials, equipment, and assembly flow integration (molded packages like TOLT, TOLG, Q-DPAK DIP, SIP and case modules).
• Prior experience scaling HV packages and modules from concept to high volume manufacturing.
• Good understanding of clip attach, flip chip packaging and overview of wafer bumping processes
• Strong knowledge of HV Bill of Materials (Mold compounds, Die Attach, DBC substrates etc.).
• Good understanding of industry & subcon HV packaging capabilities & roadmaps.
• Strong knowledge of Silicon / GaN / SiC-package interaction and hands on experience with stress, thermal and electrical modeling analysis and tools.
• Overview of high voltage discrete and power modules reliability and qualification requirements, proven ability to define and drive reliability and qualification strategies in alignment with these standards and problem solving
• Track record of presenting at international conferences or symposiums related to power electronics, semiconductor packaging, or high-voltage technologies.
• Proficiency in English and Japanese