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What You Can Expect
What We're Looking For
Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 4+ years of related professional experience. Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3+ years of experience.
Expected Base Pay Range (USD)
124,420 - 186,400, $ per annumThe successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions.The expected base pay range for this role may be modified based on market conditions.
Additional Compensation and Benefit Elements
Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at
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What You Can Expect
Design and develop 2.5D packages, such as CoWOS.
Utilize IC package layout tools like Cadence APD or Mentor XPD.
Implement IC package design requirements for high-speed interfaces and manage setup constraints.
Interface with IC physical design teams to optimize the ASIC die floor plan.
Collaborate with substrate suppliers, OSATs, and silicon fab vendors.
Work with IC package assembly development teams to understand and meet assembly requirements.
Automate layout tasks using scripting.
Design power planes and translate power supply requirements into the design.
Stay updated with IC packaging technologies, materials, substrate design rules, and assembly rules.
Contribute to new product introductions from concept through development and production.
Apply knowledge of thermal and mechanical analysis in IC package development.
Communicate effectively and document processes clearly.
What We're Looking For
Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5-10 years of related professional experience.
OR Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3-5 years of experience.
Experience with 2.5D package design and development, such as CoWOS.
Strong expertise in using IC package layout tools like Cadence APD or Mentor XPD.
Understanding of IC package design requirements for high-speed interfaces and setup constraints manager.
Experience in interfacing with substrate suppliers, OSATs, and silicon fab vendors.
Experience with IC layout tools is highly desired.
Ability to automate layout tasks using scripting.
Familiarity with IC packaging technologies, materials, substrate design rules, and assembly rules.
Track record of new product introduction from concept through development and production is a plus.
Knowledge of thermal and mechanical analysis of IC package development is a plus.
Strong communication, presentation, and documentation skills.
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What You Can Expect
· Leadend-to-end program management
· Drivedetailed program planning,execution, risk management, and delivery across multiple teams and geographies.
· Collaboratewith engineering, product, operations, and supply chain teams todefine program charter,scope, objectives, milestones, timelines, and resource requirements.
· Identifyand mitigate risks, proactively resolving issues that mayimpact program success.
· Provide clear, concise, and transparent communication to stakeholders at all levels, including regular status updates, executive briefings,and program reviews.
· Foster a culture of continuous improvement, applying best practicesin program managementmethodologies
· Manage, mentor, and coachjunior program managers,contributing to the growth and maturity of the planning team.
What We're Looking For
· Bachelor’sdegree in Engineering, Computer Science, or a related technical field; Master’s degree or MBA is a plus.
· 15+ years of experiencein program or project managementwithin the semiconductor industry or related high-tech sectors.
· Strong technical background with an understanding of semiconductor development processes, product life cycles, and supply chain dynamics.
· Proven ability to manage large, complex programs with cross-functional, global teams.
· Exceptionalleadership, organizational, and problem-solving skills.
· Strong communication and interpersonal skills, with the ability to influence stakeholders at all levels.
· Proficiencyin program managementtools (e.g., P6, JIRA,Microsoft Project)and methodologies (Agile, Scrum, PMP certification is a plus).
Preferred Qualifications:
· Experiencein managing AI, data center, ASIC, or networking hardware programs.
· Demonstratedsuccess in driving organizational change and process improvement initiatives.
Expected Base Pay Range (USD)
142,580 - 213,600, $ per annumThe successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions.The expected base pay range for this role may be modified based on market conditions.
Additional Compensation and Benefit Elements
Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at
These jobs might be a good fit

What You Can Expect
What We're Looking For
Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 4+ years of related professional experience. Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3+ years of experience.
Expected Base Pay Range (USD)
124,420 - 186,400, $ per annumThe successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions.The expected base pay range for this role may be modified based on market conditions.
Additional Compensation and Benefit Elements
Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at
These jobs might be a good fit