1, Good DACA Process development experience on DFN packages.在DFN封装类型上具备良好的DACA工艺开发经验。2, Well know about MOSFET overall assembly stations, experience on Die Attach & Clip Attach; Flux cleaning; Reflow curing process andequipment熟悉MOSFET全封装流程,具备晶粒粘贴、铜夹片粘贴、助焊剂清洗、回焊焊固化等工艺和设备经验。3, Has...