The point where experts and best companies meet
Principal Engineer Advanced Packaging jobs at Intel in United States, Oregon, Hillsboro
Discover your perfect match with Expoint. Search for job opportunities as a Principal Engineer Advanced Packaging in United States, Oregon, Hillsboro and join the network of leading companies in the high tech industry, like Intel. Sign up now and find your dream job with Expoint
Company (1)
Job type
Job categories
Job title (1)
United States
Oregon
Hillsboro
97 jobs found
27.05.2024
I
Intel Technology Development Principal Engineer-Advanced Metalliza... United States, Oregon, Hillsboro
Share
Description:Full job details
Defines roadmaps to meet requirements, goals and milestones for incoming technology transfer. Defines and establishes flow, procedures, and equipment configuration for the module. Extracts insights from structured and unstructured data...
These jobs might be a good fit
21.05.2024
I
Intel LTD Advanced Device Development Engineer United States, Oregon, Hillsboro
Share
Description:Full job details
Set advanced device performance targets for Process Design Kit releases and Interface with Design and Foundry partners to address circuit-level issues. AssessSilicon-to-Simulationhealth and readiness for High Volume Manufacturing. Define robust...
19.05.2024
I
Intel LTD Advanced Interconnect Device Engineer United States, Oregon, Hillsboro
Share
Description:Full job details
Define Interconnect performance targets for Process Design Kit releases, interface with design teams to understand Interconnect performance impact on overall technology entitlement commits. Use Statistics, Data Mining, and other data...
18.05.2024
I
Intel LTD Advanced Device Development Engineer United States, Oregon, Hillsboro
Share
Description:Full job details
Set advanced device performance targets for Process Design Kit releases and Interface with Design and Foundry partners to address circuit-level issues. Assess Silicon-to-Simulation health and readiness for High Volume Manufacturing....
19.05.2024
I
Intel Principal Semiconductor Research Engineer United States, Oregon, Hillsboro
Share
Description:Full job details
15+ years of experience in research with the electronic, magnetic/spintronic and ferroelectric materials and their simulation/modeling. Experience in the exploration of significantly more energy efficient devices than the complementary MOSFET...
19.05.2024
I
Intel LTD Staff Advanced Device Development Engineer United States, Oregon, Hillsboro
Share
Description:Full job details
Set advanced device performance targets for Process Design Kit releases and Interface with Design and Foundry partners to address circuit-level issues. AssessSilicon-to-Simulationhealth and readiness for High Volume Manufacturing. Define robust...
28.05.2024
I
Intel Module Development Engineer United States, Oregon, Hillsboro
Share
Description:Full job details
Possess a master's degree with 2+ years of relevant experience or. PhD degree in Mechanical Engineering or Material Science Engineering or Chemical Engineering or Electrical Engineering or Physics or Chemistry...
Share
Description:Full job details
Defines roadmaps to meet requirements, goals and milestones for incoming technology transfer. Defines and establishes flow, procedures, and equipment configuration for the module. Extracts insights from structured and unstructured data...
These jobs might be a good fit
Find your dream job in the high tech industry with Expoint. With our platform you can easily search for Principal Engineer Advanced Packaging opportunities at Intel in United States, Oregon, Hillsboro. Whether you're seeking a new challenge or looking to work with a specific organization in a specific role, Expoint makes it easy to find your perfect job match. Connect with top companies in your desired area and advance your career in the high tech field. Sign up today and take the next step in your career journey with Expoint.