Advanced Packaging Modeling Expert - Fea jobs at Applied Materials

About the Role

We are working on exciting projects, connecting materials to systems, to drive new innovations that enable a wide range of advanced Logic-Memory devices and technologies, and associated material and processes interactions. You can be part of this cutting-edge modeling and design team, where you will have the opportunity to model and simulate new technologies that answers the continuous demands for scaled devices, denser interconnects that significantly improves the system Power, Performance and Area (PPA).

This primary responsibility of this position will be to focus on DTCO modeling to support the unit process and integration flow development for next generation logic and DRAM nodes. You will play a key role in shaping the future of advanced logic and DRAM technologies by providing DTCO simulation-driven insights that influence materials, process and design decisions.

Key Responsibilities

• Development of TCAD process and device models to enable predictive analysis for advanced logic (FinFET, GAA, CFET) and DRAM architectures (6F2, 4F2 VCT and 3D DRAM)

• Development and modification of speculative process integration schemes and risk/benefit assessment.

• Extraction of compact model representation of TCAD simulated devices.

• Layout development/design of standard logic cells and DRAM array

• Interconnect modeling and parasitic resistance and capacitance extraction

• SPICE modeling and PPA projection for benchmark logic circuits & blocks and DRAM array / periphery

• Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations.

• Support technology roadmap development by evaluating new materials, interconnect structures, process flows and design.

• Drive design-of-experiment (DOE) studies and sensitivity analyses to understand key drivers of electrical performance and reliability.

• Contribute to the development and automation of internal simulation workflows, tools, and best practices to improve modeling efficiency and accuracy.

• Document and present simulation methodologies, results, and recommendations to both technical and executive audiences.

• Stay current with industry trends, emerging technologies, and academic research in advanced packaging and simulation methodologies.

Required Qualifications

• Master’s or Ph.D. in Electrical Engineering, Materials Science, Applied Physics, or a related field.

• 5–10 years of hands-on industry experience with Synopsys 3D TCAD process, device, parasitic extraction and spice modeling tools towards logic or memory technology development.

• Strong fundamental understanding of semiconductor device physics related to logic and DRAM technologies.

• Familiarity with logic (FinFET, GAA and CFET) and DRAM process integration flows (FEOL / MOL / BEOL) and 3D device structures.

• Experience with logic benchmark circuits and PPA evaluation methodologies.

• Experience with DRAM array and periphery operation.

• Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows.

• Excellent analytical, problem-solving, and communication skills.

• Proven ability to work independently and collaboratively in a fast-paced, cross-functional environment.

• Strong problem-solving abilities in interdisciplinary areas

• Ability to present scientific and/or experimental results in a concise and convincing manner

• Desire to stay up to date with industry challenges and recent advancements

• Passionate and highly motivated to learn new things

Preferred Qualifications

• Experience with device and circuit level reliability modeling

• Recent experience with writing research papers for conference and journal publications

• Experience with standard cell characterization, RTL synthesis, DRC/LVS and place-and-route and timing analysis flows

• Experience in calibration tohardware/measurementsand correlations

What We Offer

• ​ About the Role

  We are looking for an expert, highly experienced Senior FEA Engineer to join our Advanced Packaging Modeling team in Santa Clara, CA. This is a critical role focused on developing thermal-mechanical simulations to support the design, development, and qualification of next-generation semiconductor packaging technologies. You will play a key role in shaping the future of advanced packaging by providing simulation-driven insights that influence architecture, materials, and process decisions.

  This position offers the opportunity to work at the forefront of semiconductor innovation, collaborating with engineers and researchers across multiple business units including design, process integration, reliability, and manufacturing.

  Key Responsibilities

  • Develop and validate detailed finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages.

  • Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures (e.g., flip-chip, fan-out, 2.5D/3D IC, chiplet-based designs, TSVs).

  • Conduct thermal modeling to assess heat dissipation in complex package structures, supporting thermal design optimization and advanced cooling technology development.

  • Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations.

  • Support technology roadmap development by evaluating new materials, interconnect structures, and process flows from a thermo-mechanical reliability perspective.

  • Drive design-of-experiment (DOE) studies and sensitivity analyses to understand key drivers of package performance and reliability.

  • Contribute to the development and automation of internal simulation workflows, tools, and best practices to improve modeling efficiency and accuracy.

  • Document and present simulation methodologies, results, and recommendations to both technical and executive audiences.

  • Stay current with industry trends, emerging technologies, and academic research in advanced packaging and simulation methodologies.

• ​Required Qualifications

  • M.S. or Ph.D. in Mechanical Engineering, Materials Science, Applied Physics, or a related field.

  • 5–10 years of hands-on industry experiencein thermal-mechanicalFEA modeling, in the semiconductor or electronics packaging domain.

  • Thorough understanding of advanced packaging technologies, including flip-chip, fan-out wafer-level packaging (FOWLP), 2.5D/3D integration, chiplet architectures, and through-silicon vias (TSVs).

  • Proficient with commercial FEA tools such as ANSYS, Abaqus, COMSOL, or equivalent.

  • Strong knowledge of materials behavior, including polymers, metals, ceramics, and their interactions under thermal and mechanical loads.

  • Familiaritywith semiconductorpackaging processes, including die attach, underfill, molding, bumping, and reflow.

  • Excellent analytical, problem-solving, and communication skills.

  • Proven ability to work independently and collaboratively in a fast-paced, cross-functional environment.

  Preferred Qualifications

  • Experiencewith multi-physicssimulations, including coupledelectro-thermal-mechanicalanalysis.

  • Familiarity with JEDEC reliability standards and qualification tests (e.g., TCoB, HTS, uHAST, drop test).

  • Experience with scripting andautomation (e.g.,Python, TCL, MATLAB) to streamline simulation workflows.

  • Exposure to package design tools such as Cadence, Mentor Graphics, or equivalent.

Key Responsibility:

• Conceptualize, develop and facilitate management and organizational development programs and initiatives in the US.
• Define and manage complexity of programs with multiple stakeholders including Business Leaders, HR Business Partners, TD team members, and other relevant HR stakeholders.
• Design innovative and state of the art learning solutions that change behavior and improve performance, velocity and scale.
• Utilize expert facilitation skills for delivering management and professional development interventions and programs across the organization.
• Has coaching abilities to support leader feedback (including but not limited to 360)
• Contribute to the thinking, practice, and dissemination of Talent Management Best Known Methods (BKMs) throughout the organization.

Skills, Experience, and Education:

• 10+ years of experience in organization development and/or management development
• Strategic and systems thinking; complex change management
• Demonstrate well-developed interpersonal skills, communication skills, and diplomacy, to successfully manage up and down the organization, with individuals at all levels
• Experience in a complex global company in a fast-paced environment preferred
• Instructional design with focus on designing management development solutions
• Effectively engage with leaders across the organization (including senior leader/ stakeholders). Effect outcomes through impactful influence.
• Combine a “consultative” mind-set/approach for diagnosis and development with an execution focus
• Experienced in TD program management including aligning multiple priorities, setting lead indicators and tracking progress in achieving objectives
• Experienced in using practical tools/models for leadership, management, organization, team, and talent improvement interventions and applying them at scale
• Global experience and mindset with flexibility to understand unique business/regional needs
• Able to work in a fast paced, intense, complex, global organization on multiple projects with a clear focus on execution and results
• Agile in ability to respond to changing organizational needs, adjusting resources and timelines
• Open-minded and curious to new perspectives and innovative strategies
• Bring a sense of urgency, energy and focus to achieving goals
• Patient and measured in response to challenges, collaborating effectively within and across

What We Offer

Applied Materials’ is looking to recruit an outstanding engineer to support its computational modeling group. In this role, you will use state-of-the-art simulation tools to simulate the complex multi-physics environment in Applied Materials’ products and work closely with engineers across multiple business units to develop new solutions to difficult problems. You will work closely with design and process engineers to enhance existing products as well as play a key role in the development of next-generation chambers and processes.

Required qualifications:
-PhD inComputer/Mechanical/Aerospace/ChemicalEngineering or related field
-Hands-on experience applying machine learning, statistical analysis, anddesign-of-experimentstechniques to simulation and modeling workflows
-Comfortable working with large-scale datasets and extracting actionable insights
-Proficient in one or more programming languages (e.g., C/C++,MATLAB/Python/etc.)
-Strong communication skills, both written and verbal

Experience with one or more of the following:
- commercial and/or academic plasma simulation tools (e.g., HPEM, Ace+, VizGlow, Comsol, VSim)
- commercial and/or academic multi-physics simulation tools (e.g. Ace+, Ansys, Comsol)
- electromagnetic and magnetostatic simulation tools (e.g., Ansys HFSS, Ansys Maxwell)
- deep understanding of chemical kinetics and fluid dynamics for industrial applications
- hands-on experience with solver and algorithm development
- hands-on experience with UI development

Key Responsibilities

Design, collect data, analyze and compile reports on a wide range of complex process engineering experiments for multiple products, within safety guidelines

Utilize techniques to characterize hardware, define methods and apply new technologies to characterize hardware, and/or perform hardware characterization on a wide range of complex systems for multiple products, within safety guidelines

Generate internal and external documentation for products, presentations, technical reports and generate process engineering specifications

Develop, plan and execute process engineering projects, within safety guidelines

Train engineers in measurement techniques of film properties and guide them in the interpretation of the data, new methodologies, trouble shooting techniques and resolve a wide range of complex process engineering issues/problems for multiple products

Design and implement new technology, products and analytical instrumentation

Identify, select and work with vendors and suppliers with limited to no supervision

Functional Knowledge

• Demonstrates depth and/or breadth of expertise in own specialized discipline or field
• This role's focus is 3D packaging and hybrid bonding. Must have skills are: flip chip assembly, 2.5D / 3D packaging, wafer level assembly, and hybrid bonding.

Business Expertise

• Interprets internal/external business challenges and recommends best practices to improve products, processes or services

Leadership

• May lead functional teams or projects with moderate resource requirements, risk, and/or complexity

Problem Solving

• Leads others to solve complex problems; uses sophisticated analytical thought to exercise judgment and identify innovative solutions

Impact

• Impacts the achievement of customer, operational, project or service objectives; work is guided by functional policies

Interpersonal Skills

• Communicates difficult concepts and negotiates with others to adopt a different point of view

Key Responsibilities

• On-site Process Integration for novel wafer level assembly flows including but not limited to hybrid bonding, TSV and RDL technology.
• Works with business unit in technology development and transfer to customers including customized process development.
• Plans unit process sequence based on customer requirements.
• Negotiates process specifications and service offerings with customers.
• Takes ownership of delivering the required solution to the customers that meets specification.
• Serves as the customer expert across a broad range of products.
• Plays a key role in defining product strategy and identifying gaps.
• Provides feedback to business unit heads on process and hardware improvements to meet customer roadmap requirements.
• Takes the lead in positioning new technologies to customers utilizing technical information from division.
• Interfaces with customers at key development and manufacturing sites to form strategic partnerships to evaluate new and emerging technologies and oversees joint development activities or beta-site testing programs.
• Makes executive level presentations.
• Resolves significantly complex field process issues utilizing systematic troubleshooting methodology generally involving multiple processes.
• Create a mechanism to communicate issues, track progress and pull resources from multiple BU's and/or functions.
• Uses sound statistical techniques and problem solving methodologies like DOEs (Design of Experiment) to quickly determine root cause and action plans.
• Communicates learnings from this portion to rest-of-world to strengthen the product packages
• Provides oversight of customer demos, including defining demo conditions and analyzing results.
• Assists account teams in managing the customer account to enhance customer satisfaction and increase AMAT’s product and technical reputation.
• Keeps abreast of new developments in own and related technology groups. Participates in publishing in ET conferences and journals.

Functional Knowledge

• Regarded as the technical expert in Wafer Advanced Packaging Technology
• Demonstrates in-depth expertise in Wafer Advanced Packaging Technology and broad knowledge of Advanced Packaging 2d, 2.5D and 3D packaging architectures.

Business Expertise

• Anticipates business and regulatory issues; recommends product, process or service improvements

Leadership

• Leads projects with notable risk and complexity; develops the strategy for project execution

Problem Solving

• Solves unique and complex problems with broad impact on the business; requires conceptual and innovative thinking to develop solutions

Impact

• Impacts the direction and resource allocation for program, project or services; works within general functional policies and industry guidelines

Interpersonal Skills

• Communicates complex ideas, anticipates potential objections and persuades others, often at senior levels, to adopt a different point of view

What We Offer

General Profile:Requires knowledge and experience in own discipline; still acquiring higher-level knowledge and skills. Builds knowledge of the company, processes and customers. Solves a range of complex problems. Analyzes possible solutions using standard procedures. Receives a moderate level of guidance and direction.

Problem Solving (2 - Working Experience); Planning: Tactical and Strategic (1 - Basic Understanding); Reliability Engineering (0 - No Experience); Collaboration (2 - Working Experience); Data Analytics (1 - Basic Understanding); Quality Methodologies (0 - No Experience); CI Product Characterization (2 - Working Experience); Knowledge Transfer and Management (1 - Basic Understanding); Leading Change (1 - Basic Understanding); CI Methodologies (2 - Working Experience); Listening & Communication (1 - Basic Understanding); Producing Results (1 - Basic Understanding); Project Management (1 - Basic Understanding); Accuracy & Attention to Detail (2 - Working Experience); Influencing (2 - Working Experience); Decision Making and Critical Thinking (1 - Basic Understanding)

Key Responsibilities

Lead optimization of the Value Stream by elimination of waste and making flow improvements across or within manufacturing, supply chain, logistics, and/or service product operations.

Lead and facilitate Lean Six Sigma process improvement methods and tools to eliminate waste and drive continuous improvement. Deliver improvements to Operation’s KPI’s.

Lead Kaizen Events, 8D and Green Belt level projects within and across operations to optimize performance.

Functional Knowledge

• Demonstrates expanded conceptual knowledge in own discipline and broadens capabilities

Business Expertise

• Understands key business drivers; uses this understanding to accomplish own work

Leadership

• No supervisory responsibilities but provides informal guidance to new team members

Problem Solving

• Solves problems in straightforward situations; analyzes possible solutions using technical experience and judgment and precedents

Impact

• Impacts quality of own work and the work of others on the team; works within guidelines and policies
  

Interpersonal Skills

• Explains complex information to others in straightforward situations

Education:Technical Diploma

4 - 7 Years