Ic Packaging Integration Engineer jobs at Apple in United States, San Diego
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Company (1)
Job type
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Job title (1)
United States
State
San Diego
549 jobs found
13.06.2024
A
Apple IC Packaging Integration Engineer United States, California, San Diego
We are looking for someone experienced in the semiconductor packaging and/or system integration. Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material,...
BS and 3+ years of relevant industry experience. Proficiency with major mechanical design CAD tools, such as Siemens NX, AutoCAD, SpaceClaim, SolidWorks, etc. Proven capability of setting up equipment and...
Proven capability in mechanics and mathematics. Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.). Proficiency with numerical simulation software tools and expert in Matlab and/or Scientific Python....
We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development. Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process...
We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development. Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process...
We are looking for an individual with experience as a process integration, manufacturing, R&D engineer in substrate industry In-depth knowledge of substrate technology. Familiarity with PKG process & criteria is...
5+ years of experience working in package design and assembly process development for memory wirebond, stacked-die packages. Proven understanding of assembly design rules, SIPI, and layout tradeoffs to enable high...
We are looking for someone experienced in the semiconductor packaging and/or system integration. Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material,...
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