Packaging Substrate Engineer jobs at Apple in United States, Cupertino
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Company (1)
Job type
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Job title (1)
United States
State
Cupertino
1,458 jobs found
13.06.2024
A
Apple Packaging Substrate Engineer United States, California, Cupertino
We are looking for an individual with experience as a process integration, manufacturing, R&D engineer in substrate industry In-depth knowledge of substrate technology. Familiarity with PKG process & criteria is...
Experience in the packaging design and assembly process development for stacked-die memory packages. Proven knowledge of wirebond and flip-chip assembly process applied to thin-die stacking. Hands on experience using packaging...
5+ years’ experience in memory package architecture and assembly process development for stacked-die packages. Strong knowledge of advanced packaging technology, design rules, SIPI, to architect high-density packages. Strong knowledge of...
We are looking for someone with 2+ years’ experience in package design and assembly process development for stacked-die memory packages. Strong knowledge of wirebond and flip-chip assembly process applied to...
BS with 5+ years of semiconductor packaging/assembly experience. M.S or Ph.D. in Mechanical Engineering, Physics, Materials Science or similar disciplines. Prior optical packaging experience with LED, photodiode and optical component...
Proven capability in mechanics and mathematics. Hands-on experience of major FEM tools (e.g., ANSYS, ABAQUS, Hypermesh, etc.). Proficiency with numerical simulation software tools and expert in Matlab and/or Scientific Python....
Proficiency with major mechanical design CAD tools, such as Siemens NX, AutoCAD, SpaceClaim, SolidWorks, etc. Proven capability of setting up equipment and data acquisition systems. Hands-on experience of major material...
We are looking for an individual with experience as a process integration, manufacturing, R&D engineer in substrate industry In-depth knowledge of substrate technology. Familiarity with PKG process & criteria is...
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